Thermo-Mechanical Analysis of a Surface-Mounted Resistor
Application ID: 481
The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components producing heat it is a well-known problem that temperature cycling can lead to cracks propagating through the solder joints, resulting in premature failure.
For electronics in general there is a strong interest in changing the soldering material from lead- or tin-based solder alloys to other mixtures. This multiphysics example models the heat transport and structural stresses and deformations resulting from the temperature distribution using the Heat Transfer in Solids and Solid Mechanics interfaces.
This model example illustrates applications of this type that would nominally be built using the following products:Heat Transfer Module Structural Mechanics Module
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Grille de spécifications and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.