Application ID: 31
In modeling of transport by diffusion or conduction in thin layers, we often encounter large differences in dimensions of the different domains in a model.
If the modeled structure is a so-called sandwich structure, we can replace the thinnest geometrical layers with a thin layer approximation, provided that the difference in thickness is very large.
This method can be used in many diffusive problems, such as heat and current conduction as well as molecular diffusion. In this model, this technique is used to model a conductive media problem, where a thin film is located between two plates. The thin film approximation model is then compared with the full 3D model.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Grille de Spécifications and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.