La Bibliothèque de Modèles présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une très grande variété d'applications, dans les domaines électrique, mécanique, fluidique et chimique. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, notamment les instructions de construction pas à pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles correspondant à votre domaine d'intérêt, et connectez vous avec votre compte COMSOL Access, associé à une licence COMSOL, afin de télécharger les fichiers modèles.
Electrodeposition Modulex

Pulse Reverse Plating

This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... En Savoir Plus

Aluminum Anodization

When anodizing aluminum, the surface is electrochemically altered to form an abrasive and corrosion-resistive Al2O3 film. The electrode kinetics during the process are only marginally affected as the oxide layer grows, so a stationary analysis of the current distribution is sufficient to ... En Savoir Plus

Electrode Growth Next to an Insulator

This example shows how to model secondary current distribution and electrode growth with a moving geometry. To avoid numerical instabilities, a seed layer is introduced in the initial geometry to obtain a right angle at the edge between the growing electrode and the insulator. En Savoir Plus

Superfilling Electrodeposition

This example illustrates the concept of superfilling in electrodeposition. The deposition rate is accelerated in concave areas of the surface, where the concentration of a surface catalyst is increased due to the area contraction of the moving boundary. En Savoir Plus

Electrodeposition of a Microconnector Bump with Deforming Geometry in 3D

This model simulates the shape evolution of a microconnector bump over time as copper deposits on an electrode surface. Transport of cupric ions in the electrolyte occurs by convection and diffusion. The electrode kinetics are described by a concentration dependent Butler-Volmer ... En Savoir Plus

A Two Phase Model For A Five Layer PEM Fuel Cell MEA

A low temperature PEM fuel cell produces water on the cathode side, and for higher currents liquid water will form in the porous layers and in the flow field The presence of liquid water has a large impact on the humidification of the ion-conducting polymer electrolyte, the transport of ... En Savoir Plus

Secondary Current Distribution in a Zinc Electrowinning Cell

This is a model of the secondary current distribution in a zinc electrowinning cell. The model investigates the impact on the current distribution when changing the electrode alignment in a parametric study. The geometry is in 2D. En Savoir Plus

Rotating Cylinder Hull Cell

Rotating cylinder Hull cells are an important experimental tool in electroplating and electrodeposition and are used for the measurement of nonuniform current distribution, mass transport, and throwing power of plating baths. The model reproduces the results for a commercially available ... En Savoir Plus

Copper Electroless Deposition

Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper. In electroless deposition, partial oxidation and reduction reactions ... En Savoir Plus

Electrodeposition of a Microconnector Bump in 2D

This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal ... En Savoir Plus