La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This example simulates the thermodynamical evolution of moist air in an electronic box with the aim of detecting whether condensation occurs when the external environment properties change. The model imports measured data for the air temperature, pressure, and water vapor concentration. ... En savoir plus
When a temperature gradient in a gas exists, suspended particles will tend to move from regions of high temperature to low. The force which produces this effect is called the thermophoretic force. Gas molecules colliding with a particle from the hot side have a higher velocity than the ... En savoir plus
This tutorial model demonstrates the use of the multiphysics coupling feature Thermal Connection, Layered Shell, Surfaces. In this model, one layered shell is connected to heat domains by a facing boundary. The results obtained with the Heat Transfer in Shells interface are compared with ... En savoir plus
This classical verification model solves the steady state temperature distribution in a plan disk heated by a localized heat source at its center. It shows and compare different ways to define a heat source localized on a small domain by representing it either as a geometrical point or a ... En savoir plus
In the semiconductor industry, rapid thermal annealing (RTA) is a semiconductor process step used for the activation of dopants and the interfacial reaction of metal contacts. In principle, the operation involves rapid heating of a wafer from ambient to approximately 1000–1500 K. As soon ... En savoir plus
The model is defined as a benchmark case in norm 15026:2007 annex A. The purpose of the model is to calculate the temperature and moisture profiles at different times after a change in the external conditions (temperature and relative humidity) inside a wall material (kind of concrete). ... En savoir plus
This tutorial model demonstrates the use of the multiphysics coupling feature Thermal Connection, Layered Shell, Edges. In this model, three layered shells are connected to heat domains by edges at difference locations related to the heat domains. The results obtained with the Heat ... En savoir plus
This tutorial model demonstrates the use of the multiphysics coupling feature Thermal Connection, Layered Shell, Surfaces. In this model, three layered shells are connected to heat domains by interior and exterior boundaries. The results obtained with the Heat Transfer in Shells ... En savoir plus
Shell-and-tube heat exchangers are commonly used in oil refineries and other large chemical processes. In this model, two separated fluids at different temperatures flow through the heat exchanger, one through the tubes (tube side) and the other through the shell around the tubes (shell ... En savoir plus
This model shows how to define a frequency-domain analysis of heat transfer. The 3-omega method uses the Cahill's equation to approximate the thermal conductivity of a sample from the measured temperature of a metal strip placed on top of it and subject to oscillating heating. The 2D ... En savoir plus