La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
In this example, the External Stress feature in the Solid Mechanics interface is used to provide the material model with the nonsymmetric stress required in the design of an elastic invisibility cloak. The cloak is a domain with special material properties aimed at shielding a region of ... En savoir plus
Hydrogen embrittlement refers to the degradation of metal ductility due to the absorption of hydrogen. The metal becomes more brittle and thus cracks might initiate at lower stress levels. It is important to estimate hydrogen concentration and the speed at which it diffuses into the ... En savoir plus
In this conceptual example, the soft impact between two elastic rings is modeled using the Solid Mechanics interface. One of the rings is given an initial velocity to initiate the impact event. Both rings are unconstrained and not subjected to any external forces. Contact is modeled ... En savoir plus
The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer, is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced due to the difference ... En savoir plus
Delamination or the separation of layers is a common failure mode in laminated composite materials. Various factors, including loading, defects in the material, and environmental conditions can trigger the initiation and propagation of layer separation. This leads to degraded structural ... En savoir plus
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... En savoir plus
In this example of a peristaltic pump, rollers squeeze a flexible tube and the compression drives a fluid through the tube. The model demonstrates how to use the Fluid-Structure Interaction interface. The main advantage of the peristaltic pump is that no seals, valves or other internal ... En savoir plus
In this example, a rotor supported on two hydrodynamic bearings is analyzed. An eccentric disk located between the two bearings causes the rotor to whirl. One of the bearings is misaligned with the axis of the rotor. The Beam Rotor with Hydrodynamic Bearing interface in the ... En savoir plus
This is a tutorial example, showing how to work with pretensioned bolts. Various aspects of bolt modeling are explored: Modeling bolts as solids or by beams Connections of beams to solid components Bolts ended by nuts or by internal threads in the attached component Import of bolt and ... En savoir plus
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... En savoir plus
