La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This is a conceptual model illustrating how to couple fluid-structure interaction, heat transfer, and thermal expansion. A bimetallic strip in an air channel is heated so that it bends. After some time, an airflow with an inlet temperature which varies in time is introduced. As a ... En savoir plus
Ion implantation is used extensively in the semiconductor industry to implant dopants into wafers. Within an ion implanter, ions generated within an ion source are accelerated by an electric field to achieve the desired implant energy. Ions of the correct charge state are selected by ... En savoir plus
This model describes a modal analysis of a crankshaft. The pistons’ reciprocating movement is transferred to the crankshaft through connecting rods by means of crankshaft throws. The forces, torques, and bending moments, which are highly variable both in time and space, subject the ... En savoir plus
The thin low permittivity gap boundary condition is meant to approximate a thin layer of material with low relative permittivity compared to its surroundings. This boundary condition is available for electrostatic field modeling. This example compares the thin low permittivity gap ... En savoir plus
This example is a model of a continuous casting process. Liquid metal is poured into a mold of uniform cross section. The outside of the mold is cooled and the metal solidifies as it flows through. When the metal leaves the mold, it is completely solidified on the outside, but still ... En savoir plus
This model simulates atmospheric galvanic corrosion of a busbar, which includes a copper flange, an aluminum alloy flange in contact with a zinc nut and bolt. The Secondary Current Distribution interface is used to solve for the electric potential in electrode domain and Current ... En savoir plus
This example uses the Shallow Water equations to model the impact of a water wave on a column. A body of water with a height of 0.3 meters is initially contained behind a gate. At the start of the simulation, the gate is suddenly released and the body of water forms a wave moving toward ... En savoir plus
A surface mount resistor is subjected to thermal cycling. The difference in the thermal expansion of different materials will introduce stresses in the structure. The solder which connects the resistor with the printed circuit board is seen as the weakest link in the assembly. It ... En savoir plus
Although initially invented to be used in printers, inkjets have been adopted for other application areas, such as within the life sciences and microelectronics. Simulations can be useful to improve the understanding of the fluid flow and to predict the optimal design of an inkjet for a ... En savoir plus
In this example, the properties of an engineeredmaterial are modeled by a spatially varying dielectric distribution. Specifically, a convex lens shape is defined via a known deformation of a rectangular domain. The dielectric distribution is defined on the undeformed, original ... En savoir plus