La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Using a Fluid-Solid Interaction multiphysics interface, the behavior of a spring-loaded ball check valve is studied under varying functional and reverse flow. The fluid force acting on the ball opens the valve at the opening pressure. In the case of a reversed pressure, the ball comes ... En savoir plus
Aldicarb is a commercial pesticide, used on a variety of crops, including cotton, fruits, potatoes, and beans. This arises in the possibility that the general population may be exposed to aldicarb through the ingestion of contaminated water and foods. This example looks at the ... En savoir plus
This model illustrates how to implement a multiphysics contact. It models the thermal and electrical behavior of two contacting parts of a switch. The electrical current and the heat flow from one part to the other only through the contact surface. The contact switch device has a ... En savoir plus
This model analyzes the thermal expansion in a MEMS device, such as a microgyroscope, where thermal expansion should be minimized. The device is made from the copper-beryllium alloy UNS C17500 and uses temperature-dependent material properties from the Material Library. The purpose of ... En savoir plus
This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the ... En savoir plus
Steel pipelines are often subjected to complex stress/strain conditions in the oil and gas industry. Additionally, pipes are subjected to significant longitudinal strain due to soil movement. For the elastoplastic stress simulation, the Solid Mechanics interface is used with the small ... En savoir plus
This is a model of a moving-coil loudspeaker where a lumped parameter analogy represents the behavior of the electrical and mechanical speaker components. The Thiele-Small parameters (small-signal parameters) serve as input to the lumped model, which is represented by an Electric Circuit ... En savoir plus
This simple benchmark model computes the potential and carrier concentrations for a one-dimensional p-n junction using both the finite element and finite volume methods. The results are compared with an equivalent device from the book, "Semiconductor Devices: A Simulation Approach," by ... En savoir plus
The S-N curve, also called the Wöhler curve, is one of the most popular methods for fatigue evaluation. The curve relates stress amplitude to the limiting fatigue life and can be obtained directly from a set of standard fatigue test. Many times our applications are subjected to ... En savoir plus
This app demonstrates the following: Geometry parts and parameterized geometries Sending an email with a report when the computation is finished User-defined email server settings which is useful when running compiled standalone applications Options for setting different mesh sizes ... En savoir plus