La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
An antenna array is a group of radiating elements. By controlling the phase and magnitude of the input signal assigned to each antenna element and the number of array elements, the radiation pattern can be steered in a desired direction with a preferred level of gain. In this example, a ... En savoir plus
The graviational three body problem involves the calculation of the positions and velocities of three objects under mutual gravitational attraction, given their position and velocity at some initial time. While the three-body problem does not have a general analytic solution and is ... En savoir plus
When modeling the propagation of charged particle beams at high currents and relativistic speeds, the space charge and beam current create significant electric and magnetic forces that tend to expand and focus the beam, respectively. The Charged Particle Tracing interface uses an ... En savoir plus
A stent is a wire-mesh tube used to open a coronary artery during angioplasty, a process for the removal or compression of plaque. Their design is of significance for percutaneous transluminal angioplasty with stenting. During this procedure, a stent is deployed into the blood vessel by ... En savoir plus
In the semiconductor industry, rapid thermal annealing (RTA) is a semiconductor process step used for the activation of dopants and the interfacial reaction of metal contacts. In principle, the operation involves rapid heating of a wafer from ambient to approximately 1000–1500 K. As soon ... En savoir plus
This model describes the three heat transfer modes: conduction, convection, and radiation, combined with nonisothermal flow in a realistic geometry representing a light bulb and the surrounding air. The LED chips dissipate heat. The model computes the equilibrium temperature induced by ... En savoir plus
These tutorial models show how to use the tools to assist with defining surface-to-surface radiation models. In the first model, radiation direction symbols are used to find an unexpected configuration where the opacity is not correctly defined. In the other, the topology check ... En savoir plus
In modeling of transport by diffusion or conduction in thin layers, we often encounter large differences in dimensions of the different domains in a model. If the modeled structure is a so-called sandwich structure, we can replace the thinnest geometrical layers with a thin layer ... En savoir plus
In this model, the packing behavior of grains is simulated using three force models: Hertz-MD, Hertz-MD with adhesion, Hertz-MD with adhesion and van der Waals forces. The packing efficiency is calculated to quantify the extent of packing observed. En savoir plus
This model demonstrates the effect of the hopper design on the resulting flow patterns of the grains exiting the hopper. The flow changes from mass flow to funnel flow when the conical angle of the hopper is increased. En savoir plus
