La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This model simulates arc welding of a titanium plate made from an alpha-beta titanium alloy. During a weld pass, the material experiences a thermal transient, including both heating and cooling. Phase transformations are modeled, and the evolution of the phase composition over time is ... En savoir plus
Crimping is the plastic deformation process used to form an electrical joint between a stranded conductor and a terminal. The process involves complex multi-surface contact, including self-contact, as the terminal sleeve is plastically deformed around the wire strands. This example ... En savoir plus
This model shows how to model a simple Metal–Insulator–Metal (MIM) diode. The two metal electrodes are defined on each side using the Metal Contact feature. Two studies were performed: one without quantum tunneling across the potential barrier and the other including it, using the WKB ... En savoir plus
In a cooling system, a microelectronic component has been identified as the critical link. Since the power is repeatedly switched on and off, the component is subjected to thermal cycling. As a results a crack grows through a solder joint and disconnects the chip from the printed circuit ... En savoir plus
A magnetic brake consists of a permanent magnet, which induces currents in a rotating copper disk. The resulting eddy currents interact with the magnetic flux to produce Lorentz forces and subsequently a braking torque. The disk angular velocity is computed using Simulink®. En savoir plus
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... En savoir plus
The modal dispersion in a metamaterial can be engineered by changing the type of material and dimension of the composing unit cells. For instance, a periodically organized subwavelength metal–dielectric layered metamaterial exhibits an anisotropic dispersion characteristic in the ... En savoir plus
This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach, the thin domains are modeled with thermal resistors in the Lumped Thermal System ... En savoir plus
This tutorial model solves the Gross–Pitaevskii Equation for the vortex lattice formation in a rotating Bose–Einstein condensate bound by a harmonic trap. The equation is essentially a nonlinear single-particle Schrödinger Equation, with the inter-particle interaction represented by a ... En savoir plus
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... En savoir plus
