La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper. In electroless deposition, partial oxidation and reduction reactions ... En savoir plus
This tutorial example serves as an introduction to the Corrosion Module and models the metal oxidation and oxygen reduction current densities on the surface of a galvanized nail, surrounded by a piece of wet wood, which acts as electrolyte. The protecting zinc layer on the nail is not ... En savoir plus
This example shows how to image the interior permittivity of a box by applying a potential difference on the boundaries of the box. The result is a surface charge density that depends on the permittivity of the medium inside the box. Read about this tutorial model in our blog post "The ... En savoir plus
This tutorial compares experimental data from the literature with a COMSOL model of a MOSCAP with interface traps (surface states). The Trap-Assisted Surface Recombination feature is used to simulate the effects of the trap charges and the processes of carrier capturing and emitting by ... En savoir plus
This models pressure-dependent heating of 4 inch wafer on unipolar electrostatic chuck. Wafer sits on top of ring with electrostatic force holdong down wafer to counter upward pressure from gas flowing in gap between wafer and chuck surface. It is a problem involving 4 coupled physics ... En savoir plus
This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using ... En savoir plus
In the diffuse double layer and within the first few nanometers of an electrode surface, the assumption of electroneutrality is not valid due to charge separation. Typically, the diffuse double layer may be of interest when modeling very thin layers of electrolyte including those in ... En savoir plus
Pitting corrosion is a type of localized corrosion by which local cavities, pits, are formed on an initially smooth metal surface. A pit may be initialized by surface defects, such as an inhomogeneities in composition or shape, or mechanical abuse resulting in a small scratch or dent. ... En savoir plus
This example studies a narrow vertical cylinder placed on top of a reservoir filled with water. Because of wall adhesion and surface tension at the air/water interface, water rises through the channel. Surface tension and wall adhesive forces are often used to transport fluid through ... En savoir plus
This parametrized model can be used to simulate the hopping hoop problem. A rolling ring with a point mass on the perimeter can, under certain conditions, jump up from the surface on which it is rolling. A more detailed description of this model can be found in the blog post "The ... En savoir plus