La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
In many structural dynamics applications, some components are stiff compared to the supporting structure. Such a stiff part will only contribute to the dynamic properties of the structure through its mass and moment of inertia. It is then possible to reduce the model size significantly ... En savoir plus
The propagation of elastic waves in the ground after a seismic event is simulated using a 2D model. The effect of the ground surface topology on the wave propagation is illustrated when an ideal half-space is modified with the presence of a small mountain. The model is a variation of ... En savoir plus
A contactor wedge is subject to a gravity load and is forced to slide due to a boundary load over a rigid target wedge surface, both infinitely wide. Horizontal linear springs are also connected between the left vertical boundary and the ground. This is a large sliding problem including ... En savoir plus
A fuel cell stack operates at temperatures just below 100 °C, which means that it has to be heated at start-up. The fuel cell stack consists of unit cell of anode, membrane, and cathode connected in series through bipolar plates. This study presents a model that couples the thermal and ... En savoir plus
As integrated circuit (IC) technology advances, with circuits becoming more powerful and compact, it is increasingly important to identify and prevent any cause of circuit failure. One particularly critical factor contributing to circuit failure is electromigration within the ... En savoir plus
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... En savoir plus
The eigenfrequencies of a rotating blade are studied in this benchmark. It shows how stress stiffening and the combined effect from stress stiffening and spin softening affects the fundamental eigenfrequency. High rotational speed in rotating machineries can result in centrifugal forces ... En savoir plus
The External Material functionality makes it possible to program your own material models for cases when the built-in material models are not sufficient. For structural mechanics, you have the possibility to either completely define the material model in a domain, or to add an inelastic ... En savoir plus
The model studied is a benchmark for a hinged cylindrical panel subjected to a point load at its center. A linear buckling analysis predicts the critical buckling load. Such an analysis will however not give any information about what happens at loads higher than the critical load. ... En savoir plus
This is a benchmark model involving stick-slip friction of a ring rolling inside another ring. The displacement of the inner ring is computed and compared to the analytical result. This model also shows how to tackle friction dominated contact problem. En savoir plus
