La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
In many structural dynamics applications, some components are stiff compared to the supporting structure. Such a stiff part will only contribute to the dynamic properties of the structure through its mass and moment of inertia. It is then possible to reduce the model size significantly ... En savoir plus
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... En savoir plus
This example shows how to use response spectrum analysis to verify the integrity of a structure that is exposed to an earthquake. The building is modeled as a steel frame, using beam elements. Displacements and stresses are computed. En savoir plus
This example explores the shift in natural frequencies caused by changing the temperature. One study investigates a doubly clamped beam where both ends are fixed, while the other study looks at a cantilever beam where only one end is fixed. The following effects are studied: Stress ... En savoir plus
This example shows how to set up self-contact for a coil spring. As the spring is compressed by a vertical force applied to one of its ends, it comes into to contact with itself and starts to rotate. En savoir plus
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... En savoir plus
In this benchmark example, a semi-elliptical crack at the inner surface of a cylinder is studied. The inside of the cylinder and the crack faces are subjected to a pressure load. The J-integral is calculated along the crack front, and the stress intensity factor is then compared with the ... En savoir plus
A contactor wedge is subject to a gravity load and is forced to slide due to a boundary load over a rigid target wedge surface, both infinitely wide. Horizontal linear springs are also connected between the left vertical boundary and the ground. This is a large sliding problem including ... En savoir plus
This example shows how to implement a stress dependent material model. The Young's modulus changes based on the stress value. En savoir plus
This conceptual example shows how to handle a transient contact problem with stick-slip friction transition. A soft hollow pipe subjected to gravity is released at the top of a halfpipe. The pipe motion varies between sliding and rolling, depending on its position in the halfpipe and its ... En savoir plus