La Bibliothèque de Modèles présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une très grande variété d'applications, dans les domaines électrique, mécanique, fluidique et chimique. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, notamment les instructions de construction pas à pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles correspondant à votre domaine d'intérêt, et connectez vous avec votre compte COMSOL Access, associé à une licence COMSOL, afin de télécharger les fichiers modèles.

Generalized Kelvin Viscoelastic Material

The behavior of viscoelastic materials can be represented by conceptual models composed of elastic and viscous elements connected in series or in parallel. The rheology of the generalized Kelvin model (also called generalized Kelvin-Voigt model) consists of an elastic spring to represent the instantaneous stiffness plus n Kelvin-Voigt branches connected in series. This example shows how to ...

Instability of a Space Arc Frame

This model illustrates the instability of a space arc frame under concentrated vertical loading. A small lateral load is applied to break the symmetry of the structure. Members in the frame are modeled using geometrically nonlinear beam elements. The results are compared with available literature data.

Scordelis-Lo Roof Shell Benchmark

In this example a thin curved membrane is built and solved using the Shell interface. This model is a widely used benchmark model denoted the Scordelis-Lo roof. The computed maximum z-deformation is compared with the value given in Proposed Standard Set of Problems to Test Finite Element Accuracy, Finite Elements in Analysis and Design, 1985.

Pressure Sensor Moisture Absorption

For their integration in microelectronic circuits, MEMS devices are bonded on printed circuit boards and connected with other devices. Then, the whole circuit is often covered with an epoxy mold compound (EMC) to protect the devices and their interconnects with the board. The epoxy polymers used for such applications are subject to moisture absorption and hygroscopic swelling, which can lead to ...