COMSOL Multiphysics Applied to MEMS Simulation and Design

Dr. Piotr Kropelnicki[1]
Mu Xiao Jing[1]
Wan Chia Ang[1]
Cai Hong[1]
Andrew B. Randles[1]

[1]Institute of Microelectronics, Agency for Science, Technology and Research, Singapore, Singapore
Published in 2013

In this research, we performed multiple COMSOL Multiphysics® simulations. We analyzed the dispersion curves of waves in a LAMB wave pressure sensor; simulated a thin metal film in a microbolometer and observed the resulting stress; investigated the thermal behavior of an acoustic wave microbolometer; and modeled the fluid-structure interaction (FSI) for piezoelectric-based energy harvesting from fluid sources.