COMSOL Multiphysics Applied to MEMS Simulation and DesignDr. Piotr Kropelnicki
Mu Xiao Jing
Wan Chia Ang
Andrew B. Randles
Institute of Microelectronics, Agency for Science, Technology and Research, Singapore, Singapore
In this research, we performed multiple COMSOL Multiphysics® simulations. We analyzed the dispersion curves of waves in a LAMB wave pressure sensor; simulated a thin metal film in a microbolometer and observed the resulting stress; investigated the thermal behavior of an acoustic wave microbolometer; and modeled the fluid-structure interaction (FSI) for piezoelectric-based energy harvesting from fluid sources.