Fracture on Circuit Board Internal Layers Due to Thermal Stress on Soldered Pins
Publié en 2013
Circuit board failures are often ignored because they could be impreceptible. This simulation examines how internal layers around a soldered pin via subject to temperature changes during the soldering process are affected, show the forces involved and determine breaking points. A 2D thermo-mechanical model of a soldered pin is achieved in two simulation steps. First, a connecting pin already attached to a fixed circuit board is placed in the via of a secondary circuit board, both are heated to a temperature according to the soldering process, then as a second step, the tin-solder is placed between the pin and secondary circuit board to finally let the system cool down.
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- figueroa_poster.pdf - 0.73MB
- figueroa_abstract.pdf - 0.26MB