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Frequency Analysis of Si-Wafers with Variable Size and Boundary Conditions
Publié en 2015
Silicon wafers represent key elements in modern microelectronics or photovoltaics. Technological fabrications of wafer sizes with large diameters (e.g. 450 mm) allow an efficient realization for integrated circuits at low cost. However, this material shows a high sensitivity to vibrations that strongly depends on size and the positioning as well as orientation of a wafer in a mounting, realized e.g. by single fixed points located at the rim of the device.
Numerical simulations of deformation and vibrations response are thus of high importance for the optimization of handling of wafers during mounting and storage.
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- gehrig_poster.pdf - 0.45MB
- gehrig_paper.pdf - 1.52MB
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