Modeling System Dynamics in a MEMS-Based Stirling Cooler
Publié en 2011
Micro-scale devices based on the Stirling cycle are an attractive choice for chip- and board-level electronics.
A new Stirling cycle micro-refrigeration system composed of arrays of silicon MEMS cooling elements has been designed. COMSOL is used to evaluate the thermal performance of the system. Simulation of compressible flow and heat transfer with a large deformed mesh has been successfully implemented and is used to determine the cooling capacity and coefficient of performance, COP.
Future work will focus on modeling the coupling of the thermal fluid phenomena with electrostatics.
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