Articles techniques et présentations

Chipmakers widely use the plasma-enhanced chemical vapour deposition (PECVD) technique for depositing thin dielectric or conducting films on wafers. The primary objective for a deposition process is to have a good flow and species uniformity on the wafer. Typically, a carefully designed showerhead is used to deliver the precursor gas. A multi-species flow model available with commercial code COMSOL is used to analyse, design and achieve the objective. The reaction rate on the wafer surface is tuned based on available data. The geometrical parameters and the flow rates from the showerhead are optimized to achieve the desired uniformity.