Ici vous trouverez les présentations issues des Conférences COMSOL à travers le monde. Réalisées par des utilisateurs de COMSOL Multiphysics, ces présentations explorent tous les domaines actuels d'innovation. Les applications couvrent pratiquement tous les secteurs industriels et impliquent des phénomènes électriques, mécaniques, fluidiques et chimiques. Utilisez la recherche rapide pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt.

Numerical Investigation of the Convective Heat Transfer Enhancement in Coiled Tubes

L. Cattani[1]
[1]Dipartimento di Ingegneria Industriale, Università degli Studi di Parma, Parma, Italy

The work is focused on the numerical analysis of forced convection in curved tubes investigating the correlation between the heat transfer and friction factor enhancement and the effects of the wall curvature. The analysis was performed by integrating the continuity, momentum and energy equations within COMSOL Multiphysics. The local Nusselt number reaches values higher than the ones expected ...

Simulation of Current Density for Electroplating on Silicon Using a Hull Cell

F. Lima[1], U. Mescheder[1], H. Reinecke[3]
[1]Hochschule Furtwangen University, Furtwangen, Baden-Wuerttemberg, Germany
[3]Institut für Mikrosystemtechnik, Freiburg im Breisgau, Baden-Wuerttemberg, Germany

Electrodeposition has a major advantage over other methods of thin film deposition. It allows deposition at atmospheric pressure and room temperature, requiring inexpensive equipment. However, there are several parameters which can influence an electroplated metal layer quality. The current density distribution is taken into consideration. The Hull cell is an electrodeposition tank with a ...

Thermal Simulations of a LED Light Using COMSOL Multiphysics

M. Maaspuro[1]
[1]University of Turku, Turku, FInland

An experimental LED light composed of a multi-chip LED-module, a LED driver and an efficient heat sink, was investigated using COMSOL Multiphysics software and the Heat Transfer Module. In an LED light heat is mainly generated in the LEDs but some amount of heat is generated also in the LED driver. The main target of the simulations was to resolve the junction temperatures of LEDs, the most ...

COMSOL Analysis of Acoustic Streaming and Microparticle Acoustophoresis

H. Bruus[1], P.B. Muller[1], R. Barnkob[1], M.J.H. Jensen[2]
[1]Technical University of Denmark, Kongens Lyngby, Denmark
[2]COMSOL, Kongens Lyngby, Denmark

We have simulated the ultrasound-induced acoustophoretic motion of microparticles suspended in an aqueous solution. The full first-order thermoviscous acoustics equations have been implented on a rectangular microfluidic 2D domain excited with an ultrasound field tuned to resonance near 2 MHz. The micrometer-thin but crucial viscous boundary layers at the rigid walls have been fully resolved. ...

Ammonia Removal From Water by a Liquid-Liquid Membrane Contactor Under a Closed Loop Regime

E. Licon[1], S. Casas[1], A. Alcaraz[1], J.L. Cortina[1], C. Valderrama[1]
[1]Universitat Politécnica de Catalunya, Barcelona, Spain

Ammonia separation from water by membrane contactor was simulated on transient state and compared with experimental data. Aqueous low concentrated solution of ammonium with high pH has been pumped inside the hydrophobic hollow fibers, acid solution in the outside part. The system is in closed loop configuration. In order to simulate the separation process, equations were developed considering ...

Simulation of Impact Damage in a Composite Plate and Its Detection

V. Pavelko[1], I. Pavelko[1], M. Smolyaninovs[1], H. Pffeifer[2], M. Wevers[2]
[1]Riga Technical University, Riga, Latvia
[2]Catholic University Leuven, Leuven, Belgium

A problem of damage prediction in aircraft structure and its non-destructive evaluation is very important for aircraft structural health assessment. The analysis of the features of direct impact of thin-walled laminate component of aircraft was performed by COMSOL Multiphysics software. Mainly the GFRC and CFRC laminates were selected in form either thin separate plate or sandwich structure. The ...

Geometric Modeling and Numerical Simulation of Airfoil Shapes Using Integrated MATLAB® and COMSOL Multiphysics

A. Safari[1], H. Lemu G.[1], H. Severson[1]
[1]University of Stavanger, Stavanger, Norway

This paper proposes a framework for an efficient integration between geometric modeling program and analysis tool for a coming automated aerodynamic design optimization mission. This demand can be addressed by using both in-house codes and commercial software which have the good ability of live-link and efficient integration. In this study, the mathematical modeling of a turbomachinery airfoil ...

A Numerical Comparison of Dielectric based Measurement of Atmospheric Ice Using COMSOL

U. N. Mughal[1], M. S. Virk[1]
[1]Narvik University College, Narvik, Norway

Atmospheric ice is a very complex material with varying electrical properties due to different polymorphs of ice itself. Also, if the medium to be considered is snow, then density becomes an additional parameter because it is a mixture of three dielectrics water, ice and air. The permittivity and loss tangent of naturally occurring ice and snow shows lot of variation at different conditions ...

Solar Cell Cooling and Heat Recovery in a Concentrated Photovoltaic System

M. Cozzini[1]
[1]Fondazione Bruno Kessler (FBK), Renewable Energies and Environmental Technologies (REET) Unit, Trento, Italy

Concentrated photovoltaic systems with high efficiency solar cells are being widely investigated, aiming at improving the cost-efficiency balance in the solar energy field. Different cell types are in use: e.g., high concentration triple junction cells, reaching efficiencies of the order of 35 - 40 % at 1000 suns, and medium concentration mono-crystalline silicon cells, with efficiencies of the ...

Modeling of Pulsed Laser Thermal Annealing for Junction Formation Optimization and Process Control

R. Negru [1], K. Huet[1], P. Ceccato[1], B. Godard[1]
[1]Excico, Gennevilliers, France

It is now a well known that the next generation devices in many fields of the semiconductor industry will be based on 3D architectures. In this framework, low thermal budget annealing technological solutions are required. For many applications, either in the field of sensors, microprocessors or high density memories, the Laser Thermal Annealing (LTA), an ultrafast and low thermal budget process, ...

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