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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

Consultez les proceedings de la Conference COMSOL 2024

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Heat Transfer and Phase Change

A Multiphysics Approach to Fundamental Conjugate Drying by Forced Convection

M. de Bonis, and G. Ruocco
DITEC, Universitµa degli studi della Basilicata, Campus Macchia Romana, Potenza, Italy

Heat and mass transfer involved in drying is studied by using COMSOL 3.4. The effect of air temperature on the performance of the drying process applied to fresh food slices is scrutinized. COMSOL’s flexible formulation is exploited by using special drying kinetics for the substrate, ... En savoir plus

A Numerical Investigation on Active Chilled Beams for Indoor Air Conditioning

G. Cammarata, and G. Petrone
Department of Industrial and Mechanical Engineering, University of Catania, Catania, Italy

In this study fluid-dynamical and thermal performance of active chilled beams is investigated by 2D and 3D modelling in COMSOL Multiphysics. Three different typologies of those air conditioning systems are considered. Results, obtained for typical range of variation of operational ... En savoir plus

Modeling Joule Heating Effect on Lunar O2 Generation via Electrolytic ...

Modeling Joule Heating Effect on Lunar O₂ Generation via Electrolytic Reduction

J. Dominguez[1], S. Poizeau[2], and L. Sibille[1]

[1]ASRC Aerospace Corporation, Kennedy Space Center, Fl, USA
[2]Massachusetts Institute of Technology, Cambridge, MA, USA

Kennedy Space Center is leading research work on lunar O2 generation via electrolytic reduction of regolith. The metal oxide present in regolith is dissociated into oxygen anions and metal cations leading to the generation of gaseous oxygen at the anode and liquid metal at the cathode. ... En savoir plus

Numerical Simulation of Si Nanosecond Laser Annealing by COMSOL Multiphysics

M. Darif, and N. Semmar
GREMI-UMR6606, CNRS-Universite d’Orleans, Orléans, France

A 2D transient heat conduction model was created in COMSOL Multiphysics to simulate temperature changes in material irradiated by a KrF laser beam confined on silicon’s surface. In this paper, the obtained results are shown and discussed in case of bulk Silicon. The heat source is ... En savoir plus

Transient Conjugate Optical-thermal Fields in Thin Films Irradiated by Moving Sources: A Comparison between Back and Front Treatment

N. Bianco[1], O. Manca[2], and D. Ricci[2]
[1]Dipartimento di Energetica, Termofluidodinamica applicata e Condizionamenti ambientali, Università degli Studi di Napoli Federico II, Napoli, Italy
[2]Dipartimento di Ingegneria Aerospaziale e Meccanica, Seconda Università degli Studi di Napoli, Aversa (CE), Italy

A two dimensional instationary analysis of the conjugate optical-thermal fields induced in a multilayer thin film structure on a glass substrate by a moving Gaussian laser source is carried out numerically in order to compare back and front laser treatment processes. COMSOL Multiphysics ... En savoir plus

High Temperature Process Simulation

O. Geoffroy, and H. Rouch
INOPRO, Villard de Lans, France

The crystal growth industry uses high temperature processes. To improve production efficiency, a good knowledge of thermal effects is necessary. We show in this article a methodology to get reliable data by mixing simplified models, sensitivity studies and parameters adjustments. The ... En savoir plus

Simulation of the Temperature Profile During Welding with COMSOL Multiphysics® Software Using Rosenthal's Approach

A. Lecoanet[1], D. G. Ivey[1], H. Henein[1]
[1]Department of Chemical & Materials Engineering, University of Alberta, Edmonton, AB, Canada

A 3D finite element analysis is carried out, using COMSOL® software, to reproduce the thermal profile obtained with Rosenthal’s equation. The implemented heat transfer equation has been modified as a means to approximate Rosenthal’s solution. An analysis of the differences between the ... En savoir plus

Influência das Condições Ambientais Sobre a Umidade e Temperatura em Bobinas de Cartão

I. Neitzel[1], R. C. F. do Nascimento[1], C. C. Bueno[1]
[1]Faculdade de Telêmaco Borba - FATEB, Telêmaco Borba, Paraná, Brasil

Neste trabalho é analisado o comportamento dos perfis de temperatura e umidade e sua penetração em bobinas de papel submetidas a longos períodos de armazenagem. O modelo considera a transferência simultânea de calor e massa com o efeito Soret, mas sem o efeito Latour. O sistema é fechado ... En savoir plus

Estimativa do Fluxo de Calor em uma Ferramenta de Corte Durante um Processo de Usinagem com o Uso do Software COMSOL Multiphysics® e de Técnicas de Problemas Inversos

R. F. Brito[1], S. R. de Carvalho[2], S. M. M. de L. e Silva[1]
[1]Federal University of Itajubá - UNIFEI, Itabira, Minas Gerais, Brasil
[2]Federal University of Uberlândia - UFU, Uberlândia, Minas Gerais, Brasil

This work proposes the use of inverse problem techniques in connection with COMSOL to estimate the heat flux and the temperature field on a turning cutting tool in transient regime. The main purpose of the present work is to present the improvements performed in relation to the authors’ ... En savoir plus

Modeling of Arc Welding Power Source

E. S. Tschoepke[1], J. A. E. Mazzaferro[1], G. Paz[1]
[1]Universidade Federal do Rio Grande do Sul, Porto Alegre, RS, Brazil

Introduction: The main objective of the present work consists in modeling an arc welding heat source to allow predict peak temperature and cooling rate at specific points. The filler metal was deposited on a plate of 32mm thick with no chamfer, in bead on plate configuration, using five ... En savoir plus

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