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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

Consultez les proceedings de la Conference COMSOL 2024

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Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... En savoir plus

Modelling of Micro/Macro Densification Phenomena of Cu Powder during Capacitor Discharge Sintering

G. Maizza[1] and A. Tassinari[1]

[1]Dipartimento di Scienza dei Materiali ed Ingegneria Chimica, Politecnico di Torino, Torino, Italy

Capacitor Discharge Sintering (CDS) is an ultrafast Electric Current Assisted Sintering method (u-ECAS) suited for electrically conductive powders. It is characterized by relatively short processing times (milliseconds range) and much lower sintering temperatures than the melting point ... En savoir plus

Modelling of SiC Chemical Vapour Infiltration Process Assisted by Microwave Heating

G. Maizza[1] and M. Longhin[1]
[1]Dipartimento di Scienza dei Materiali ed Ingegneria Chimica, Politecnico di Torino, Torino, Italy

The excessive presence of residual SiC matrix inter-fiber pores is often the main cause for the very poor mechanical strength and toughness of SiC/SiC composites manufactured by CVI (Chemical Vapour Infiltration) process. This work presents a micro/macro Microwaveassisted Chemical Vapour ... En savoir plus

Numerical Simulation of Pulsed TIG Welding Partial and Full Penetration

A. Traidia[1][2], F. Roger[1], and E. Guyot[2]

[1]Ecole Nationale Supérieure de Techniques Avancées, Palaiseau, France
[2]AREVA NP, Centre Technique Soudage, France

In this poster, a numerical model of spot pulsed current TIG welding for partially and fully penetrated weld pools is presented. Heat transfer and fluid flow in the weld pool driven by the combination of electromagnetic force, buoyancy force, surface tension gradient and latent heat are ... En savoir plus

Streamer Propagation in a Point-to-Plane Geometry

M. Quast[1] and N.R. Lalic[1]
[1]Gunytronic GmbH, St Valentin, Germany

Corona discharge is used in several applications such as surface treatment of polymers, photocopying or dust removal in air conditioning. Streamer formation is undesirable for most of these applications. Therefore, several studies have been dedicated to investigate the formation and ... En savoir plus

Two-dimensional Analysis of Triple Coupled Physics of Structural Mechanics, Diffusion and Heat Transfer in a Gas Pipe

P. Lee-Sullivan[1], and M. Haghighi-Yazdi[1]
[1]Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario, Canada

In this study, a 2-D model has been built using COMSOL Multiphysics® to analyze a triple coupled physics problem involving simultaneous gas diffusion, heat transfer, and structural mechanics in a pipe due to the flow of high-pressure carbon dioxide. The problem geometry and boundary ... En savoir plus

Optimization of Carbon Nanotube Field Emission Arrays

B. L. Crossley[1], M. Kossler[1], P.J. Collins[1], R. A. Coutu Jr.[1], and L. A. Starman[1]

[1]Air Force Institute of Technology, Wright-Patterson AFB, Ohio, USA

Carbon nanotubes (CNTs) have been proven experimentally to be well suited for field emission applications. An optimized triode configured CNT field emission array is developed using the COMSOL Multiphysics Electrostatics Application to adjust five key physical dimensions to investigate ... En savoir plus

Coupled Structural and Magnetic Models: Linear Magnetostriction in COMSOL

J. Slaughter[1]
[1]Etrema Products, Inc., Ames, Iowa, USA

Accurate modeling of magnetostrictive materials and devices requires coupling of electrical, magnetic, mechanical, and possibly acoustic domains. There are relatively few finite element software packages that include all these physical models and even fewer that include magnetostrictive ... En savoir plus

Coupled Magnetic-Structural Finite Element Analysis

S. V. Kulkarni[1], and S. Alapati[1]
[1] Department of Electrical Engineering, Indian Institute of Technology Bombay, Maharashtra, India

In general, there is a wide range of applications requiring coupled electromagneticstructural analysis. In this paper, two of such coupled problems have been analyzed. The first one is a transient analysis of Electromagnetic Forming process and the other problem is a deformation analysis ... En savoir plus

Design of Arrayed Micro-Structures to get Super-Hydrophobic Surface for Single Droplet and Bulk Flow Conditions

A. Mall[1], P. R. Jelia[1], A. Agrawal[1], R. K. Singh[1], and S. S. Joshi[1]

[1] Department of Mechanical Engineering, Indian Institute of Technology Bombay, Maharashtra, India

Surfaces with water contact angle greater than 150º are super-hydrophobic in nature and possess extraordinary water repelling properties. Various researches on wettability of textured surfaces in recent years have shown that texturing surfaces with micron-sized and nanosized patterns ... En savoir plus

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