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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

Consultez les proceedings de la Conference COMSOL 2024

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Simulation of Fast Response Thermocouple for the Nuclear Reactor Core

K. Dusarlapudi[1], B. K. Nashine[2], D. Bai[3], and C. S. Babu[1]
[1]KL University, Vaddeswaram, Guntur, Andhra Pradesh, India
[2]E.D&S.S, IGCAR Kalpakkam, India
[3]VIT, Vellore, India

Thermocouples have been used for measurement of temperature ever since the discovery of Seebeck effect. Though the voltage output of a thermocouple is a function of the temperature difference between hot and cold junctions, the response time and the magnitude of voltage depends on the ... En savoir plus

Coupling of Wired PCB With Microwave Radiation – 3D Simulation and Experimental Valuation

T. D. Bui[1], F. Bremerkamp[2], and M. Nowottnick[2]
[1]Department of Automobile Engineering, Thanh Do University, Ha Noi, Vietnam
[2]Institute of Electronic Appliances and Circuits, Department “Reliability and Safety of Electronic Systems”, University of Rostock, Rostock, Germany

Modern electronic assemblies and printed circuit boards (PCB) with their sensitive structures and elements have to be protected against environmental influences by conformal coating or casting compounds. In this case the main challenge is the simultaneous curing of the polymers and the ... En savoir plus

Electrical and Thermal Analysis of an OLED Module

J. Kundrata[1], A. Baric[1]
[1]Faculty of Electrical Engineering and Computing, University of Zagreb, Zagreb, Croatia

This paper presents the electrical and thermal analysis of an OLED module. The OLED module consists of the OLED tile and the DC-DC converter incorporated in its backplane. The DC-DC converter is realized as an integrated circuit and its inductor is embedded in the the backplane. The DC ... En savoir plus

Optimization of Design Parameters of a Novel MEMS Strain Sensor used for Structural Health Monitoring of Highway Bridges

H. Saboonchi, and D. Ozevin
Civil Engineering Department
University of Illinois at Chicago
Chicago, IL

The novel Micro Electro Mechanical System (MEMS) based Piezoresistive stain sensor is presented in this paper. The main goal of this sensor is to monitor the localized strain in the highway bridges especially near the crack tips. Monitoring the crack growth on the bridges can lead to ... En savoir plus

Flow-induced Vibrations of the Uvula and its Implication on Snoring

J. Xi[1], Q. M. Mohamad[1], Y. E. Yuan[1], J. Rohlinger[1]
[1]Mechanical and Biomedical Engineering, Central Michigan University, Mount Pleasant, MI, USA

Flow-induced uvula deformation considerably altered the flow dynamics inside the nose. For a weak soft palate, complete flow occlusion can occur (sleep apnea). Vibration of the airway structures is crucial to better understand snoring generation mechanisms and breathing-related ... En savoir plus

Copper Electroplating Parameters Optimization

L. M. A. Ferreira [1],
[1] CERN , Geneva, Switzerland

Aqueous based copper electroplating seems the most reliable, flexible, cost effective method to create a copper layer on stainless steel coupler devices; this however, doesn’t imply a straightforward application, as subcomponents geometry is complex and tolerances are tight. At CERN, two ... En savoir plus

Dynamic Observation of Magnetic Particles in Continuous Flow Devices by Tunneling Magnetoresistance Sensors

A. Weddemann[1], A. Auge[1], F. Wittbracht[1], C. Albon[1], and A. Hütten[1]

[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

Dynamic measurement of magnetic particles in continuous flow devices is made very difficult by the limitations imposed by the sensors themselves. Thus, certain sensor layouts are restricted to either number sensitive or spatial resolutive measurements of magnetic particles. We ... En savoir plus

Modelling of SiC Chemical Vapour Infiltration Process Assisted by Microwave Heating

G. Maizza[1] and M. Longhin[1]
[1]Dipartimento di Scienza dei Materiali ed Ingegneria Chimica, Politecnico di Torino, Torino, Italy

The excessive presence of residual SiC matrix inter-fiber pores is often the main cause for the very poor mechanical strength and toughness of SiC/SiC composites manufactured by CVI (Chemical Vapour Infiltration) process. This work presents a micro/macro Microwaveassisted Chemical Vapour ... En savoir plus

Fluid-Structure Interaction Modeling for an Optimized Design of a Piezoelectric Energy Harvesting MEMS Generator

I. Kuehne[1], A. van der Linden[2], J. Seidel[1], M. Schreiter[1], L. Fromme[2], and A. Frey[1]
[1]Siemens AG, Corporate Research & Technologies, Munich, Germany
[2]Comsol Multiphysics GmbH, Göttingen, Germany

This paper reports the design of a piezoelectric energy harvesting micro generator for an energy autonomous tire pressure monitoring wireless sensor node. For our design we use a piezoelectric MEMS generator approach without additional mass. The intrinsic mass of the cantilever is in the ... En savoir plus

Current Density Distribution and Material Removal Behavior on the Graphite/Iron-matrix Interface in Cast Iron Under Pulse Electrochemical Machining Conditions

O. Weber[1], R. Kollmannsperger[2], D. Bähre[2]
[1]Center for Mechatronics and Automatization, Saarbrücken, Germany
[2]Institute of Production Engineering, Saarland University, Saarbrücken, Germany

The Pulse Electrochemical Machining is especially suitable for the precise production of complex geometric contours with high precision and high surface quality demands in workpieces in series manufacturing. During this process, the negative structure of an electrode is copied to the ... En savoir plus

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