- Bridging the Terahertz Gap
- Modeling the Lithium-Ion Battery
- Protection contre la Corrosion
- Modélisation des batteries
- Modélisation et Simulation dans le développement des piles à combustible
- Modélisation thermique des petits satellites
- Analyse électro-vibroacoustique d'un transducteur à armature équilibrée
Découvrez comment la simulation multiphysique contribue à faire progresser la recherche dans le monde entier grâce à des applications innovantes
La modélisation et la simulation multiphysiques stimulent l'innovation dans l'industrie et le monde universitaire, comme en témoignent les nombreuses applications présentées chaque année par des ingénieurs, des chercheurs et des scientifiques dans leurs articles techniques et posters lors des conférences COMSOL.
Inspirez-vous des travaux présentés lors des dernières conférences, rassemblés ci-dessous. Pour trouver une présentation en particulier ou affiner votre recherche par domaine d'application, année ou lieu de conférence, utilisez l'outil de recherche rapide.
Consultez les proceedings de la Conference COMSOL 2026
The anode baking process has gained significant attention since the 1980s due to its importance in Aluminium industry. A good anode baking process strives to achieve multiple goals including reduction of NOx from emissions. NOx generation is mainly due to the high-temperature ... En savoir plus
Seasonal thermal energy storage (STES) systems are key components for expanding the renewables share in the energy scheme as they offer the dispatchability and flexibility. Therefore, thermal behaviour of such systems is of interest. STES can influence the surroundings causing a ... En savoir plus
Non-contacting guided wave tomography based on laser ultrasonic waves can be used to inspect structures that are inaccessible to traditional ultrasound methods. Such structures could be, chemically or physically hard to reach, e.g. hot metal structures, metal implants inside tissue or ... En savoir plus
Whispering-gallery mode resonators (WGR) are promising elements for future photonic devices, as they combine ultra-high quality factor with small size and mode volume. Many practical applications of such microresonators, such as ultra-sensitive chemical and biological sensors [1] electro ... En savoir plus
The interaction of high power laser beam with metallic materials produces a number of interconnected phenomena that represent a serious challenge for numerical modeling, especially for creation of auto-consistent models. Additional difficulty consists in lack of data on materials ... En savoir plus
Through Silicon Via (TSV) is one of the key technologies for 3D integration. It is a vertical electrical connection that passes through a silicon wafer and establishes the signal transmission between the front and the backside of the device. In the so-called “TSV last” integration ... En savoir plus
Introduction With the vast development in the aerospace industry it is inevitable that currently used materials such as Nickel based super alloys will soon reach its peak performance. Hence developing alternative materials with similar properties that could be enhanced further is ... En savoir plus
A concept of an adaptive sound absorbing material is proposed and investigated numerically using the COMSOL Multiphysics® Software suitable for the required advanced dual-scale modelling which involves solution of various problems of physics at the microscopic and macroscopic levels. A ... En savoir plus
