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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

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Pore-Scale Simulation of Two-Phase Flow with Heat Transfer Through Dual-Permeability Porous Medium

H.A. Akhlaghi Amiri[1], A.A. Hamouda[1]
[1]University of Stavanger, Stavanger, Rogaland, Norway

This paper addresses one of the major challenges in water-flooded oil reservoirs, which is early water breakthrough due to the presence of high permeable layers in the media. COMSOL Multiphysics is used to model two phase (water and oil) flow in dual-permeability porous medium at micro ... En savoir plus

3D Modeling of Plasmon Excitation by Grating

G.G. Gentili[1], S. Pietralunga[2], M. Bolzoni[1]
[1]Politecnico di Milano, Dipartimento di Elettronica e Informazione, Milano, Italy
[2]INFN-CNR, Istituto di Fotonica e Nanotecnologie, Milano, Italy

Grating-assisted optical coupling into long-range modes of strip plasmonic waveguides is analyzed by a 3D numerical simulation with COMSOL Multiphysics. We used the RF Module and its scattering formulation. A comparison with results obtained using the common 2D approximated analysis is ... En savoir plus

Multiphysics Simulations in the Ultrasonic Industry

P.A. Colombo[1]
[1]DepQuest, Dalmine, Italy

This work focuses on the application of multiphysics finite element simulations in the manufacturing and application of high power ultrasonic machines. Industries providing big power ultrasonic solutions as in cleaning, welding, sonochemistry and cutting fields, already apply the finite ... En savoir plus

FEM-Simulation of a Printed Acceleration Sensor with RF Readout Circuit

H. Schweiger[1], T. Göstenkors[1], R. Bau[1], D. Zielke[1]
[1]Dept. Engineering Sciences and Mathematics, University of Applied Sciences Bielefeld, Bielefeld, Germany

In this paper we want to figure out the development of a capacitive acceleration-sensor system with the FEM-Method. The sensor-system is in the position to detect accelerations in the range of ±20 g. Furthermore the sensor-element contains a printed RF-inductance, which is used for ... En savoir plus

Modeling of Pulsed Laser Thermal Annealing for Junction Formation Optimization and Process Control

R. Negru [1], K. Huet[1], P. Ceccato[1], B. Godard[1]
[1]Excico, Gennevilliers, France

It is now a well known that the next generation devices in many fields of the semiconductor industry will be based on 3D architectures. In this framework, low thermal budget annealing technological solutions are required. For many applications, either in the field of sensors, ... En savoir plus

A High Power Planar Triode Oscillator Designed by Using FEM Modeling

S. Lefeuvre[1], M. Ghomi[2]
[1]EURL CREAWAVE, Labège, France
[2]CALCEM, Ste Foy d'Aigrefeuille, France

COMSOL, adding SPICE® elements into its FEM, gives the possibility of a direct modeling of oscillators: triode and load are FEM described while all the other components of the circuit are just simulated using SPICE®. The modeling is not a straight application of any module but needs the ... En savoir plus

Modeling of Active Infrared Thermography for Defect Detection in Concrete Structures

S. Carcangiu[1], B. Cannas[1], G. Concu[2], N. Trulli[3]
[1]Department of Electric and Electronic Engineering, University of Cagliari, Cagliari, Italy
[2]Department of Civil Engineering, Environmental and Architecture, University of Cagliari, Cagliari, Italy
[3]Department of Architecture and Planning, University of Sassari, Alghero, Italy

An experimental program has been developed, with the purpose of evaluating the reliability in building diagnosis and characterization of an integrated analysis of several parameters related to heat transfer process through the building material. The Infrared Thermography Technique (IRT) ... En savoir plus

Design of Tunable Metamaterial Operating Near 90 GHz

K. Tarnowski[1], W. Salejda[1]
[1]Institute of Physics, Wroclaw University of Technology, Wroclaw, Poland

Currently there is much interest in electromagnetic metamaterials [1-9]. In our work we have focused on design of tunable metamaterial which can be made within available technology. In proposed design we use metallic split-ring resonators and thin-wires (Figure 1). Moreover we have ... En savoir plus

Scaling Effect in Air Gap MOSFET

R.V. Iyer[1], Vinay K.[1], A. R. Kamath[1], A. Goswami[1], A. Sharma[1], A. V. Joshi[1], A. Mishra[1], N. S. Pai[1], S. Chakraborty[1], Rakesh D.[1]
[1]PES Institute of Technology, Bangalore, Karnataka, India

This abstract addresses the effect of scaling in air gap MOSFETs and determination of functional relationship between scaling parameter and sensitivity, frequency response. The modelling of the MOSFET and its simulations has been carried out using COMSOL Multiphysics. An air Gap MOSFET ... En savoir plus

A MEMS Condenser Microphone for Consumer Applications

S. Kesari[1], A. Pandit[1], K. Mishra[1], Kaushal B. K.[1]
[1]Electronics and Communication Engineering, Nitte Meenakshi Institute of Technology, Bangalore, India

The MEMS microphone is also called microphone chip or silicon microphone.The pressure sensitive diaphragm is etched directly into a silicon chip by MEMS techniques and is usually accompanied with integrated preamplifier. Most MEMS microphones are variants of the condenser microphone ... En savoir plus

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