Ici vous trouverez les présentations issues des Conférences COMSOL à travers le monde. Réalisées par des utilisateurs de COMSOL Multiphysics, ces présentations explorent tous les domaines actuels d'innovation. Les applications couvrent pratiquement tous les secteurs industriels et impliquent des phénomènes électriques, mécaniques, fluidiques et chimiques. Utilisez la recherche rapide pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt.

Topology Optimization in Multiphysics Problems

Tadayoshi MATSUMORI[1]

[1]TOYOTA Central R&D Labs., Inc., Aichi, Japan

This presentation deals with a density based topology optimization for multiphysics problems implemented in COMSOL Multiphysics. Using this method, we are going to design a heat exchanger for maximizing the performance under a constant input power.

A Study on Estimation of Permittivity Distribution using a Genetic Algorithm and COMSOL® Java API

[1]Kazuyoshi TOMIYAMA et al.

Chiba Institute of Technology, Narashino, Chiba, Japan[1]

The numerical model can be dynamically modified and analyzed by using the COMSOL Java API. We estimated the relative permittivity, diameter and position of the dielectric in a experiment device based on the electric potential and the capacitance of experimental results. The estimation method was developed by the COMSOL Java API and Genetic Algorithm. In this presentation, we will introduce a ...

Analysis of Working Fluid Flow and Debris Behavior in Micro-EDM Gap Area

Masashi MACHIDA[1]

[1]Tokyo University of Agriculture and Technology, Fuchu, Tokyo, Japan

Debris, micro particles produced by discharges, stay in the gap area during deep hole machining by micro EDM, cause short-circuits and abnormal discharges, finally make machining impossible. Although a deep hole can be processed by using the tool with grooves on the surface, the effect of the tool shape on the flow of working fluid and the behavior of debris are not clear yet. In this research, ...

Elastoplastic Modeling and Experimental Verification of Solder-Substrate Interaction - new

C. Karl[1], C. Slater[1], M. Strangwood[1], K. Tank[2], S. O'Connor[2]
[1]University of Birmingham, Birmingham, UK
[2]Strip Tinning Ltd, Birmingham, UK

Solders are typically used to join similar or dissimilar metals, referred to as substrates. In some cases solders are also used to join completely different classes of materials. For example, a joint between copper busbar and silicon solar cell represents a set of dissimilar substrates. In the formation of a solder-substrate couple, the system must have been subjected to at least a single ...

Influência da Camada de Ar Sobre a Deformação de uma Embalagem de Líquido com Cartão Tipo LPB - new

I. Neitzel[1], K. B. Matos[1], L. R. Pesch[1]
[1]Faculdade de Telêmaco Borba - FATEB, Telêmaco Borba, Paraná, Brasil

As embalagens de produtos alimentícios são hoje em dia predominantemente feitas com cartão tipo LPB (Liquid Packaging Board) e usualmente estocadas de forma empilhada, tanto nas prateleiras como nos depósitos dos supermercados. O LPB é um compósito multicamadas de construção complexa, envolvendo, tipicamente, papel produzido com fibras virgens, polietileno e alumínio. O alimento líquido ao ser ...

Column Adsorption of Copper and Silver Ions on Modified Porous Glass

M. Witczak [1],
[1] Wroclaw University of Technology, Wroclaw, Poland

Constantly growing industry necessitates the development of more effective methods to protect the environment against waste in the form of metal ions. Among many methods used to purify the environment from damaging substances a very attractive and efficient method is adsorption. In this work the adsorption properties of porous glass were investigated. In order to determine the time of saturation ...

Magnetic Particle Buildup Growth on Single Wire in High Gradient Magnetic Separation  

F. Chen
Department of Chemical Engineering, M.I.T., Cambridge, MA, USA

Magnetic fluids containing nano or submicron magnetic particles and their application in food, biological and pharmaceutical systems have recently attracted increasing attention. Magnetic particles can be collected efficiently in magnetizable matrices (e.g. iron wires) in high gradient magnetic separation (HGMS) process. In this work, the dynamic buildup growth process is treated as a moving ...

Deep-Seated Spreading Model Tested on Etna Mount with FEM

F. Pulvirenti[1,2], M. Aloisi[1], M. Mattia[1], and C. Monaco[2]
[1]Istituto Nazionale di Geofisica e Vulcanologia sezione di Catania
[2]Università di Catania

Structural, morphological and ground deformation studies suggest that the eastern flank of Mt. Etna (eastern Sicily) is spreading seaward.  According to the deep-seated spreading model, both the volcanic edifice and its uppermost basement are spreading eastwards because of magma inflation processes related to a dike complex located at a depth between the summit craters and the Valle del ...

Effect of S-p Relation Model on DNAPL Migration Simulation Result

H. Ishimori[1], and K. Endo[1]
[1]National Institute for Environmental Studies, Tsukuba, Ibaraki, Japan

To consider effective counter measures against ground water contaminated with dense non-aqueous phase liquids (DNAPLs) such as chlorinated solvents, it is first important to understand the mechanism of their migration in heterogeneous aquifer. In addition, numerical analysis models to simulate such a complex migration in heterogeneous aquifer are required. The displacement pressure, which ...

Wireless Interaction of Neighboring Two Arm Archimedes Spiral Coils in the RF Electromagnet Range

A. Kalinowski[1]
[1]Naval Undersea Warfare Center/ Division Newport, Newport, RI, USA

The paper addresses a class of problems for modeling and consequently simulating the electromagnetic field radiation pattern from two arms Archimedes spiral coils. The frequency spatial wavelengths relative to the coil dimensions are in a range where the electromagnetic Maxwell’s equations are solved numerically via the RF Module of COMSOL Multiphysics. ...