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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

Consultez les proceedings de la Conference COMSOL 2024

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Design and Simulation of a Piezoelectric Actuated Valveless Micropump

J. J. Rojas [1], J. E. Morales [2],
[1] School of Electromechanical Engineering, Instituto Tecnológico de Costa Rica, Cartago, Costa Rica
[2] School of Electronic Engineering, Instituto Tecnológico de Costa Rica, Cartago, Costa Rica

Microfluidics is a multidisciplinary field, basically it designs systems to handle small volumes of fluids. Most applications require a pumping action in order to move the fluid trough the system. For most of them a micro scale active pump is highly desirable. A piezoelectric micropump ... En savoir plus

Models for Simulation Based Selection of 3D Multilayered Graphene Biosensors

E. Lacatus [1], G. C. Alecu [1], A. Tudor [1],
[1] Politehnica University of Bucharest, București, Romania

At the forefront of a new generation of sensors graphene and graphene composite materials are intensively studied for medical and biosensing applications. The outstanding electrical, mechanical and quantum properties of graphene make them a promising material solution to overlap the ... En savoir plus

Modeling Thermo-Fluid Dynamics of a Processing Unit of the Fast-track Trigger for ATLAS

N. Delmonte [1], P. Cova [1], A. Lanza [2], P. Giannetti [3], A. Annovi [3], S. Daniele [4], ,
[1] University of Parma and Istituto Nazionale di Fisica Nucleare - Sezione di Pavia, Pavia, Italy
[2] Istituto Nazionale di Fisica Nucleare - Sezione di Pavia, Pavia, Italy
[3] Istituto Nazionale di Fisica Nucleare - Sezione di Pisa, Pisa, Italy
[4] University of Parma - Department of Information Engineering, Parma, Italy

We describe the thermal modeling of a crate hosting boards with Associative Memories (AM) designed for the Fast Tracker Trigger (FTK) system of the ATLAS detector at the CERN Large Hadron Collider. FTK is a highly paralleled hardware system designed to provide global tracks reconstructed ... En savoir plus

Time Domain Construction of Acoustic Scattering by Elastic Targets Through Finite Element Analysis

A. Gunderson [1], B. Simon [1], A. Bonomo [1], M. Isakson [1],
[1] Applied Research Laboratories, University of Texas - Austin, Austin, TX, USA

Finite element models for acoustic scattering from three dimensional underwater elastic objects, calculated in the frequency domain, are transformed to the time domain through Fourier synthesis using COMSOL Multiphysics®. The time domain mirrors the way in which experimental scattering ... En savoir plus

Multiphysics Modelling of a Microwave Furnace for Efficient Solar Silicon Production

N. Rezaii [1], J. P. Mai [1],
[1] JPM Silicon GmbH, Braunschweig, Germany

The JPM Silicon GmbH presents a novel method for the production of solar grade silicon in the microwave oven. This method can specially reduce the energy costs and increase the efficiency of the process. A numerical model is developed which depicts the physical, chemical and ... En savoir plus

Simulation of a Rotary Magnetorheological Damper

D. Harder [1], L. Fromme [1], R. Naumann [2],
[1] University of Applied Sciences Bielefeld, Department of Engineering Sciences and Mathematics, Bielefeld, Germany
[2] University of Applied Sciences Bielefeld, ISyM – Institute of System Dynamics and Mechatronics, Bielefeld, Germany

This paper presents a simulation model of a rotary damper filled with a magnetorheological fluid (MRF). The most important characteristic of the MRF is the variable viscosity, which can be controlled by an external magnetic field. In the simulation model, the fluid is described as a ... En savoir plus

Topology Optimization of Thermal Heat Sinks

J. H. K. Haertel [1], K. Engelbrecht [1], B. S. Lazarov [2], O. Sigmund [2],
[1] Technical University of Denmark, Roskilde, Denmark
[2] Technical University of Denmark, Kgs. Lynby, Denmark

Introduction The topology optimization method is becoming increasingly popular as a design tool for multiphysics systems [1,2]. Topology optimization of fluid-thermal systems has been presented for example in [3] for forced convective heat transfer and in [4] for natural convection ... En savoir plus

Multiphysics Modeling of Photo-Polymerization in Stereolithography Printing Process and Validation

K. Gao [1], B.L.J. Ingenhut [1], A.P.A. van de Ven [1], F.O. Valega Mackenzie [1], A.T. ten Cate [1],
[1] TNO Materials Solutions, Brightlands Materials Center, The Netherlands

The free-radical photo-polymerization of thermoset polymers is an essential part in additive manufacturing, in particular for the Stereolithography (SLA) printing technique. A better understanding of the photo-polymerization and its relation to the process is required to improve the ... En savoir plus

Development of a Thermal Model Using COMSOL Multiphysics® Software

A. Oukaira [1], A. Lakhssassi [1],
[1] Department of Computer Science, Université du Québec en Outaouais à Hull, Gatineau, QC, Canada

The Purpose of this paper is to develop a thermal model using COMSOL Multiphysics® software that aims to get an idea of the heat flow around the ASIC, as well as to address the thermal issues for integrated circuits at the tongue board. However, we need sources of heat simulations to map ... En savoir plus

Electric Field Assisted Formation of Polymeric Hollow Microstructures

Vivek [1], S. Baranwal [1], A. Bindal [1], R. Mukherjee [1], A. Atta [1]
[1]IIT Kharagpur, West Bengal, India

Hollow microstructures find numerous applications in microsystems, bioMEMS and microfluidic systems [1]. Consequently, one-step fabrication process of hollow polymeric microstructures by external electric field along with capillary forces, termed as electric field- assisted capillarity ... En savoir plus

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