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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

Consultez les proceedings de la Conference COMSOL 2024

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Chiral surface plasmon polaritons on metallic nanowires

S. Zhang
Institute of Physics CAS
Beijing
China

Chiral SPPs can be generated by linearly polarized light incident at the end of a nanowire, exciting a coherent superposition of three specific nanowire waveguide modes. Chirality is preserved in the emitted photons, creating a subwavelength ¼ wave plate. En savoir plus

Modeling Neural Tissue and Membrane Behavior During Far-field Current Injection

R. Sadleir[1], A. Minhas[2], and E.J. Woo[2]
[1]University of Florida, Gainesville, FL, USA
[2]Kyung Hee University, Seoul, Republic of Korea

In an earlier work we developed a finite element bidomain model of an aplysia abdominal ganglion in order to estimate the sensitivity of this contrast mechanism to changes in cell membrane conductance occurring during a gill-withdrawal reflex. We used our model to determine both current ... En savoir plus

Influence of Thermal Conductivity and Plasma Pressure on Temperature Distribution and Acoustical Eigenfrequencies of High-Intensity Discharge Lamps

J. Schwieger[1], B. Baumann[1], M. Wolff[1], F. Manders[2], J. Suijker[2]
[1]Heinrich-Blasius-Institute of Physical Technologies, Hamburg University of Applied Sciences, Hamburg, Germany
[2]Philips Lighting, Turnhout, Belgium

High-intensity discharge (HID) lamps are energy-efficient light sources with excellent color qualities. A three-dimensional model of a low-wattage lamp, which includes plasma, electrodes, and burner walls, was developed in COMSOL Multiphysics®. Most parameters appearing in the coupled ... En savoir plus

Simulation of the Coalescence and Subsequent Mixing of Inkjet Printed Droplets

M.H.A. van Dongen[1], H.J. van Halewijn[2]
[1]Fontys University of Applied Sciences, Expertise Centre Thin Films & Functional Materials, Eindhoven, The Netherlands
[2]Fontys University of Applied Sciences, Eindhoven, The Netherlands

Coalescence of droplets is a widely investigated phenomenon. In inkjet printing micrometer sized droplets are deposited on a substrate which when positioned close enough to each other will coalesce and mix. Little is known about the flows and mixing behaviour within these small droplets. ... En savoir plus

Simulation of DC Current Sensor

K. Suresh, B.V.M.P.S. Kumar, U.V. Kumar, M. Umapathy, and G. Uma
National Institute of Technology Tiruchirapalli, Tamil Nadu, India

A proximity DC current sensor using of a piezo sensed and actuated cantilever beam with a permanent magnet mounted at its free end is designed and simulated in COMSOL Multiphysics. The change in resonant frequency of cantilever is a measure of the current through the wire. The sensor is ... En savoir plus

Engineering Light Photonics, Plasmonics and Meta-materials

Dr. A. Prabhakar
Dept. of Electrical Engineering, IIT-Madras, Chennai, Tamil Nadu, India

Anil Prabhakar joined the faculty at IIT-Madras in 2002, after 5 years of post-doctoral experience in the hard disk drive industry. His current research interests include photonics, spintronics, nonlinear dynamics and alternative and augmentative communication. As a member of the Optics ... En savoir plus

Effect of Thermal Contact Resistance of Heat Transfer in the Mold

K-C. Chiu[1], C-D Jih[1], M-T Chen[2], and Y-S Lin[2]
[1]Metal Industries Research & Development Centre, Taichung, Taiwan
[2]CSUN Manufacturing Limited Company, Taiwan

In this study, computational fluid dynamics analysis software (COMSOL Multiphysics) is used to predict heat transfer for the hot-pressed mold of semiconducting vacuum laminator. The predicted results are compared with the experimental measurements to verify the accuracy of simulations. ... En savoir plus

Numerical Simulation of Electrostatic Charging Droplets in Microfluidic Devices

S. Yao[1], H. Zhou[1]
[1]HKUST, Hong Kong, China

In this paper, the mechanism of charging process was simulated and analyzed. The simulation was conducted using COMSOL Multiphysics® software, based on the laminar two-phase flow level-set interface coupling with the electrostatic interface. Meanwhile, different parameters (such as the ... En savoir plus

Simulation of MEA in PEMFC and Interface of Nanometer-Sized Electrodes

Q. Zhang, Y. Liu, and S. Chen
Wuhan University, College of Chemistry and Molecular Science, Wuhan, China

COMSOL Multiphysics is a very helpful simulation software in our researches on both PEMFC and nanometer-sized electrodes. In the first part of our presentation, the influence of humidity and temperature to the performance of PEMFC are studied by simulating the MEA (membrane electrode ... En savoir plus

Formation of Porosities During Spot Laser Welding of Tantalum

C. Touvrey[1], and P. Namy[2]
[1]CEA Valduc, France
[2]SIMTEC, France

The aim of the study is to predict the formation of porosities in the case of spot laser welding of tantalum. During the interaction, a deep and narrow cavity, called the keyhole, is generated. At the end of the interaction, surface tension provokes the collapse of the keyhole. Gas ... En savoir plus

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