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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

Consultez les proceedings de la Conference COMSOL 2024

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Amsterdam 2025

Computation of Velocity, Pressure and Temperature Distributions near a Stagnation Point in Planar Laminar Viscous Incompressible Flow

E. Kaufman[1], and E. Gutierrez-Miravete[2]

[1]Pratt and Whitney, East Hartford, CT, USA
[2]Rensselaer at Hartford, Hartford, CT, USA

As gas turbine temperatures and component life requirements continue to rise, it becomes increasingly important to have a good understanding of the operating temperatures of their components. The objective of this study was to explorate whether a Hiemenz flow approximation based on ... En savoir plus

Simulation of C-MEMS Based Enzymatic Biofuel Cell

Y. Parikh, V. Penmatsa, J. Yang, and C. Wang

Department of Mechanical & Material Science Engineering, Florida International University, Miami, FL, USA

An Enzymatic Biofuel Cell (EBFC) converts the chemical energy in biological fuels into electricity. In this work, we optimize the performance of the Carbon-Micro Electro Mechanical system in an EBFC by using COMSOL Multiphysics. With a simple model, we realized that most of the glucose ... En savoir plus

Capacitance Computation of Multilayered and Multiconductor Interconnects Using Finite Element Method

S. Musa, and M. Sadiku
College of Engineering, Prairie View A&M University, Prairie View, TX, USA

The development and analysis of interconnects in inhomogeneous structures such as very large scale integration chips, printed circuit boards, and multichip modules are essential for next-generation electronic products. In this paper, we illustrate fast and sufficiently accurate ... En savoir plus

Modeling and Analysis of SMA-Based Adaptive Structures

S. Yang[1], and S. Seelecke[2]

[1]Department of Aerospace, Northwestern Polytechnical University, Raleigh, NC, USA
[2]Department of Mechanical & Aerospace Engineering, North Carolina State University, Xi’an, Shaanxi, China

The application of shape memory alloys (SMA) as actuators in smart structures is a quickly developing field. The particular focus of this paper is on the aspects of modeling and simulation of adaptive structures with integrated SMAs using the finite element method (FEM). A number of ... En savoir plus

Quasi-static Analysis on the Effect of Metal Penetrating Depth into the Substrate in Microstriplines

S. Musa, and M. Sadiku
Prairie View A&M University Networking Academy (PVNA), Prairie View, TX, USA

The effect of metallization thickness on planar transmission lines plays an essential role in microwave integrated circuits and thin film technology, especially in the propagation characterization and the electric field distribution in the structures. The objective of this paper is to ... En savoir plus

Virtual Thermal Ablation in the Head and Neck using COMSOL Multiphysics

U. Topaloglu[1], Y. Yan[2], P. Novak[2], P. Spring[3], J. Suen[3], and G. Shafirstein[3]
[1] Department of Information Technology, University of Arkansas for Medical Sciences, Little Rock, Arkansas, USA
[2]Department of Radiation Oncology, University of Arkansas for Medical Sciences, Little Rock, Arkansas, USA
[3]Department of Otolaryngology, University of Arkansas for Medical Sciences, Little Rock, Arkansas, USA

Thermal ablation in the head and neck requires accurate thermal dose delivery to target tissue while protecting the structure and function of nearby tissue and organs. In this study, we present a method that allows importing Computed Tomography (CT) scans to COMSOL, in order to model ... En savoir plus

Depth-Averaged Modeling of Groundwater Flow and Transport

P. Kitanidis
Civil and Environmental Engineering, Stanford University, Stanford, CA, USA

In many groundwater studies, the areal extent of an aquifer is much larger than its thickness so that flow and transport take place primarily in horizontal directions. Thus, the most common type of modeling in practical applications is two-dimensional involving vertically averaged ... En savoir plus

Designing Piezoelectric Interdigitated Microactuators using COMSOL

O. Myers [1], M. Anjanappa [2], and C. Freidhoff [3]

[1] Mississippi State University, Mississippi State, MS, USA
[2] University of Maryland Baltimore County, Baltimore, MD, USA
[3] Northrop Grumman Corporation, Electronics Systems Sector, Baltimore, MD, USA

This paper presents a methodology towards designing, analyzing and optimizing piezoelectric interdigitated microactuators using COMSOL Multiphysics. The models used in this study were based on a circularly interdigitated design that takes advantage of primarily the d{;sub}33 ... En savoir plus

Shape, Convection and Convergence

R. Pryor
Pryor Knowledge Systems, Inc., Bloomfield Hills, MI, USA

COMSOL Multiphysics software, when properly configured, can readily solve modeling problems in the laminar flow regime using the standard Navier-Stokes equations or in the fully turbulent flow regime using the kappa-epsilon model. Failure to solve a particular model is typically ... En savoir plus

In-Situ Detection of Inclusions in Liquid Steel

X. Wang, R. Guthrie, and M. Isac
McGill Metals Processing Centre, Montreal, Canada.

A numerical multiphase flow model is proposed to predict the behavior and motion of entrained inclusions in liquid steel, as they enter the orifice of a LiMCA (Liquid Metal Cleanliness Analyzer) sensor for assuring steel quality. The method of measurement is based on the electric sensing ... En savoir plus

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