Articles techniques et présentations

Ici vous trouverez les présentations issues des Conférences COMSOL à travers le monde. Réalisées par des utilisateurs de COMSOL Multiphysics, ces présentations explorent tous les domaines actuels d'innovation. Les applications couvrent pratiquement tous les secteurs industriels et impliquent des phénomènes électriques, mécaniques, fluidiques et chimiques. Utilisez la recherche rapide pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt.

Numerical and Experimental Study of a Concentrated Indentation Force on Polymer Matrix Composites

V. Antonucci[1][2], M. Esposito[1], R. Marzella[2], and M. Giordano[1][2]
[1]Institute for Composite and Biomedical Materials, CNR, Portici, NA, Italy
[2]Imast, Portici, NA, Italy

A quasi static indentation test on a laminate composite has been investigated numerically and experimentally. In particular, the test has been implemented by COMSOL Multiphysics® and optimizing the Finite Element and mesh. In addition, the numerical strain results have been validated by the comparison with the respective experimental deformation data that have been obtained by fiber Bragg ...

Simulation of Hygro Swelling Induced Stresses in Flip Chip Interconnects in a Stress-Sensitive Chip-on-Board Configuration

M. Fretz
Optics & Packaging, CSEM SA, Central Switzerland Center, Alpnach, Switzerland

Flip chip interconnections are used for the direct electrical connection of face-down electronic components like MEMS pressure sensors. The investigated bonding technologies are gold stud bumping in combination with anisotropic conductive adhesives (ACA) and solder ball bumping in combination with underfill in a chip-on-board configuration. The modeled chip is an absolute pressure sensor based on ...

Designing Materials for Mechanical Invisibility Cloaks

P. Olsson[1], F. Larsson[1], A. Khlopotin[1], S. Razanica[1]
[1]Chalmers University of Technology, Gothenburg, Sweden

In solid mechanics, there is considerable interest in achieving “invisibility”. The applications in mechanics include protection of structures and parts of structures from potentially harmful transient waves and steady state vibrations. A suggested large scale application is that protection against seismic waves from earthquakes could be achieved by using cloaking to re-route the waves around ...

Elastoplastic Deformation in a Wedge-Shaped Plate Caused by a Subducting Seamount

M. Ding[1], J. Lin[2]
[1]MIT/WHOI Joint Program in Oceanography, Cambridge, MA, USA
[2]Woods Hole Oceanographic Institution, Woods Hole, MA, USA

We used COMSOL Multiphysics 4.3 to simulate the 2D elastoplastic deformation and plastic strain in a wedge-shaped plate above a subducting interface. The modeling results reveal that a pair of conjugate normal faults would first appear in the thinner part of the plate. Subsequently, a second pair of conjugate thrust faults would form in the thicker part of the plate. The duration of the seamount ...

Stability of an Underground Limestone Mine

R. Haemers[1], F. Broekkamp[1], H. van Halewijn[1]
[1]Fontys University of Applied Physics, Eindhoven, The Netherlands

The hills of South-Limburg, the Netherlands, are crisscrossed with underground limestone mines. These "caves" are not equally stable, and can be dangerous. With COMSOL Multiphysics® a stability assessment has been made. The first study examines the full stress and displacement profile without excavation. In a second study the domains of the corridors are excluded, to represent the excavation ...

Simulation and Performance Analysis of Nanowire Design with Different Variants

Boopathi S[1], Ms.E.Malar[1], Deepan Chakravarthi P[1]
[1]Department of Biomedical Engineering, PSG College of Technology, Coimbatore, Tamil Nadu, India

This paper deals with an integrated numerical and experimental analysis work aiming at the investigation of the thermal stress on nanowires in electronic gadgets especially computers and mobile phones. The comparative study of the nanowires are analyzed through the Thermal Stress physics using different variants such as Cu, Al, ZnO, Si(c), SiO2 which can be used in sensors, solar cells, LCD, ...

Modeling and Simulation of High Sensitivity CMOS Pressure Sensor Using Free Boundary Circular Diaphragm Embedded on Ring Channel Shaped MOSFET - new

S. Joy[1], T. Tom[1]
[1]Rajagiri School of Engineering and Technology, Kochi, Kerala, India

Sensors have diverse applications ranging from the medical field to space exploration. They convert physical parameters such as temperature, pressure, humidity etc. into an electrical output. The discovery of piezoresistivity property of silicon and germanium led to miniaturization of pressure sensors. Improvement in the sensitivity is the major factor to be considered while designing pressure ...

Durability Analysis on Solar Energy Converters Containing Polymeric Materials

J. Wirth, S. Jack, M. Köhl, and K.-A. Weiß
Fraunhofer Institute for Solar Energy Systems ISE, Freiburg, Germany

The key issues of the Fraunhofer Institute for Solar Energy Systems are research and development of solar technologies for the fast growing market of solar energy. This paper presents examples of the usage of COMSOL Multiphysics: The ingress of water is a serious reason for the degradation of photovoltaic modules which can hardly be measured using experimental approaches yet. Therefore, a ...

Modeling the Buckling of Isogrid Plates

E. Gutierrez-Miravete[1], and J. Lavin[2]
[1]Rensselaer at Hartford, Hartford, CT, USA
[2]UTC-Pratt & Whitney, East Hartford, CT, USA

Isogrid plate components are widely used in aerospace structures because of their greater stiffness to weight ratios compared with thicker plates of the same material. Isogrid plates consist of flat plates conjoined with thin ribs in specific geometric patterns. The purpose of this study was to investigate the applicability of COMSOL Multiphysics for the determination of buckling loads and modes ...

Electro-Thermo-Mechanical Finite Element Modeling to Investigate the Reliability of Automotive MOSFET Transistor

T. Azoui, P. Tounsi, and J.M. Dorkel
CNRS, LAAS, Toulouse, France

3D electro-thermo-mechanical finite element model of power vertical MOSFET used in the automotive industry is presented in this paper. The presented paper is a qualitative study of power device results from electro-thermo-mechanical simulation. This study particularly interested in the stress generated at the interface between the bonding wires and the source metallization to evaluate the ...

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