Ici vous trouverez les présentations issues des Conférences COMSOL à travers le monde. Réalisées par des utilisateurs de COMSOL Multiphysics, ces présentations explorent tous les domaines actuels d'innovation. Les applications couvrent pratiquement tous les secteurs industriels et impliquent des phénomènes électriques, mécaniques, fluidiques et chimiques. Utilisez la recherche rapide pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt.

Mechanical Behaviour of TiAl Spherical Particles Including Friction Effect

G. Maizza, R. Cagliero, and A. Santoro
Dipartimento di Scienza dei Materiali ed Ingegneria Chimica, Politecnico di Torino, Torino, Italy

Powder metallurgy is a key technology for manufacturing advanced components based on TiAl alloys. Cold compaction is the primary step to produce green parts. Cold deformation of TiAl powder is difficult due to its typical poor ductility. Plastic deformation and cracking susceptibility of TiAl powder strongly depends on micro-mechanical phenomena. To manage real compaction problems more reliable ...

Design and Nuclear-Safety Related Simulations of Bare-Pellet Test Irradiations for the Production of Pu-238 in the High Flux Isotope Reactor Using COMSOL

J.D. Freels[1], P.K. Jain[1], R.W. Hobbs[1]
[1]Oak Ridge National Laboratory, Oak Ridge, TN, USA

The Oak Ridge National Laboratory (ORNL) is developing technology to re-establish the capability to produce plutonium-238 for the National Aeronautics and Space Administration (NASA) as a power source material for powering vehicles while in deep-space. The High Flux Isotope Reactor (HFIR) of ORNL has been utilized to perform test irradiations of in-capsulated neptunium oxide (NpO2) and aluminum ...

A Computational Approach for Optimizing the First Flyer Using COMSOL Multiphysics

A.H. Aziz[1], H. Pourzand[1], A.K. Singh[1]
[1]Pennsylvania State University, University Park, PA, USA

COMSOL Multiphysics software was used to structurally optimize the Wright brothers’ flyer. The flyer was drawn in SolidWorks, imported and meshed in COMSOL. COMSOL Solid Mechanics module was used to analyze the flyer. Four of the sixteen struts were removed yet the structural integrity of the flyer was maintained. COMSOL Laminar Flow module was used to compute the aerodynamic forces and ...

Designing and Simulating the Performance Analysis of Piezoresistive Fluid Flow Pressure Sensor

K. PraveenKumar[1], P. Suresh[1], K. Subash[1], M. Alagappan[1], A. Gupta[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India.

In this work, we present the performance analysis of novel micro machined Piezoresistive fluid flow pressure sensor using COMSOL Multiphysics. The principle of the sensing mechanism is based on the deflection of four sensing layers embedded on a thin membrane. The fluid passes through the layer causes the deflection of the sensing layer which measures the pressure of the fluid. The following ...

Simulation of Microstructured Rolling-Sliding Contacts - new

M. Weschta[1], S. Tremmel[1], S. Wartzack[1]
[1]Engineering Design, Friedrich-Alexander-University Erlangen-Nürnberg (FAU), Erlangen, Bavaria, Germany

To reduce friction in lubricated tribological contacts, the surfaces of the contacting bodies can be microstructured to improve lubricating conditions. For lower loaded contacts this approach has already reached industrial applications, e.g. the piston-liner contact. For higher loaded contacts the effects are currently in basic research. Elastic deformation in the contact area plays an important ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

On the Geometric Nonlinearity Effects of Polymeric Plates on Structural Performance - new

K. Vakkund[1], R. C. Thiagarajan[1]
[1]ATOA Scientific Technologies Pvt. Ltd., Bengaluru, Karnataka, India

Polymer sheets are widely used for glazing and roofing structural applications. The primary design requirements of these polymeric sheets are to resist uniformly distributed wind loading. Conventional building materials such as steel and glass plates are relative stiffer compared to polymeric sheets. The deflection of high stiff plates is about an order lower than polymeric plates. Polymeric ...

Multiphysics Applications for Sustainable Engineering and Industrial Processes

S. Savarese [1], L. Kremer [1], C. Sanjeu [1]
[1] Armelio, Les Ulis, France

While addressing the pressing need for better, more sustainable engineering and production improvements, Armélio has identified that easy-to-use, customized, multiphysics applications would fulfill customer requirements. Hence, we now design and deliver COMSOL Multiphysics® apps bringing multiphysics simulation into research labs and production plants. Applications range from heat transfer ...

A Model Coupling Water Transport with Local Deformation and Polymer Phase Transition

A. Briffaz [1], J. M. Méot [2], P. Bohuon [3], C. Mestres [2], B. Matignon [2], M. Dornier [3]
[1] CIRAD, Montpellier, France
[2] CIRAD, Montpellier, France
[3] Montpellier SupAgro, Montpellier, France

Describing and predicting the extent of the physicochemical processes as well as geometrical deformation taking place during food transformation is of major importance to control food functional properties. Unfortunately, only a few food-matrix models consider deformation particularly because of large deformation. In the case of a starchy product such as rice, water transport and swelling ...


高阁 [1][2], 刘震宇 [1],
[1] 中国科学院长春光学精密机械与物理研究所,长春,吉林,中国
[2] 中国科学院大学,北京,中国

In order to satisfy the requirements of modern range measuring technology, photoelectric theodolites gradually develop towards lightweight and minitype design. As a consequence, the mobile theodolite is becoming a hot spot recently. New requirements are raised for the theodolite base (Figure1), which is an essential part of photoelectric theodolites. Namely, the eigenfrequencies should be high ...