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Ici vous trouverez les présentations issues des Conférences COMSOL à travers le monde. Réalisées par des utilisateurs de COMSOL Multiphysics, ces présentations explorent tous les domaines actuels d'innovation. Les applications couvrent pratiquement tous les secteurs industriels et impliquent des phénomènes électriques, mécaniques, fluidiques et chimiques. Utilisez la recherche rapide pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt.

Consultez les proceedings de la Conference COMSOL 2024

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Boston 2024

Munich 2023

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Structural Mechanics and Thermal Stresses

An Analysis of Plunger Temperature during Glass Parison Pressing

P. Ngankeu[1], and E. Gutierrez-Miravete[2]

[1]EMHART Glass Research Inc, Windsor, CT, USA
[2]Rensselaer at Hartford, Hartford, CT, USA

The press and blow (P&B) process is widely used to produce glass containers. While the P&B process has demonstrated to be capable of reducing container weight by as much as 33%, it can also induce the formation of micro-checks that weaken container strength. This paper presents ... En savoir plus

Dynamics of Slender Structures

K. Lund
Kurt Lund Consulting, Del Mar, CA , USA

The present work formulates the dynamics of a slender structure as a long beam. This results in a PDE that is fourth-order in space, and second order in time. In COMSOL the coupling method is used to decompose this problem into two second-order equations, one for displacements, and one ... En savoir plus

Modeling and Analysis of SMA-Based Adaptive Structures

S. Yang[1], and S. Seelecke[2]

[1]Department of Aerospace, Northwestern Polytechnical University, Raleigh, NC, USA
[2]Department of Mechanical & Aerospace Engineering, North Carolina State University, Xi’an, Shaanxi, China

The application of shape memory alloys (SMA) as actuators in smart structures is a quickly developing field. The particular focus of this paper is on the aspects of modeling and simulation of adaptive structures with integrated SMAs using the finite element method (FEM). A number of ... En savoir plus

Stress State Determination in Nanoelectronic Silicon Devices Coupling COMSOL Multiphysics and a Recursive Dynamical CBED Pattern Simulation

A. Spessot[1,2], S. Frabboni[1], A. Armigliato[3], and R. Balboni[3]
[1]Numonyx Advanced R&D NVMTD-FTM, Agrate Brianza, Italy
[2]National Research Center S3, CNR-INFM and Department of Physics, University of Modena e Reggio Emilia, Modena, Italy
[3]CNR-IMM Section of Bologna, Italy

Strained technology is being promoted as the best way to extend the performance of semiconductor transistors. An inhomogeneous layer deposited on top of a silicon device can induce a strong modification in the real silicon strain state, and consequently in its electronic performance. ... En savoir plus

Computational Analysis of the Mechanical and Thermal Stresses in a Thin Film PProDOT-Based Redox Capacitor

J. Sotero-Esteva[1], M. Rosario-Canales[2], P. Gopu[3], and J. Santiago-Avilés[3]

[1]Department of Mathematics, University of Puerto Rico at Humacao, Humacao, PR
[2]Department of Chemistry, University of Pennsylvania, Philadelphia, PA, USA
[3]Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA

Among the several types of capacitors, the double-layer and redox types have gathered increasing attention to address some of the heavy power demands of modern technology. In redox capacitors, charge is stored chemically via oxidation/reduction processes in the active materials like ... En savoir plus

Analysis of the Mechanical Behavior of Violins Based on a Multi-physics Approach

E. Ravina
Dept. of Mechanics and Machine Design, Research Centre on Choral and Instrumental Music (MUSICOS), University of Genoa, Italy

The paper attempts to give a contribution to the dynamic analysis of musical instruments. A multidisciplinary approach oriented to the study of mechanical, structural, vibratory and acoustical phenomena related to stringed instruments is discussed. The case study focused in this paper ... En savoir plus

A Numerical Model for Transient Heat Conduction in Semi-Infinite Solids Irradiated by a Moving Heat Source

N. Bianco[1], O. Manca[2], S. Nardini[2], and S. Tamburrino[2]
[1]Dipartimento di Energetica, Termofluidodinamica applicata e Condizionamenti ambientali, Università degli Studi Federico II, Napoli, Italy
[2]Dipartimento di Ingegneria Aerospaziale e Meccanica, Seconda Università degli Studi di Napoli, Aversa (CE), Italy

A numerical analysis on transient three-dimensional temperature distribution in a semi-infinite solid, irradiated by a moving Gaussian laser beam, is carried out numerically by means of the code COMSOL Multiphysics. The investigated workpiece is simply a solid. A laser source is ... En savoir plus

Numerical and Experimental Analysis of Natural and Mixed Convection Heat Transfer for Vertically Arranged DIMM

G. Petrone, and G. Cammarata
University of Catania, Catania, Italy

It is commonly recognized that careful thermal design of electronic equipments represents an unavoidable pre-production step in order to ensure reliability and performance of those components during their functioning. This paper mainly concerns a comparison between experimental and ... En savoir plus

Thermal and Material Flow Modelling of Friction Stir Welding Using COMSOL

H. Schmidt[1,2], and J. Hattel[1]
[1]Technical University of Denmark, Kgs. Lyngby, Denmark
[2]HBS Engineering, Frederiksberg, Denmark

Two friction stir welding models are presented – a global thermal model using the temperature dependent heat source and a local material flow and heat generation model allowing for detailed investigation of different contact conditions. The two models are coupled into a larger local ... En savoir plus

Modeling the Thermally Induced Curvature of Multilayer Coatings with COMSOL Multiphysics^TM

H. Conrad[1], T. Klose[2], T. Sandner[2], D. Jung[1], H. Schenk[2], and H. Lakner[1,2]
[1]Semiconductor and Microsystems Technology Laboratory, Technische Universität Dresden, Germany
[2]Fraunhofer Institute for Photonic Microsystems Dresden, Germany

Within this paper the so called “birth and death” method is demonstrated in use with COMSOL Multiphysics®. With this method the free and reactionless movement of a solid structure on deformed geometries and the activation of this solid structure at later simulation steps is possible. For ... En savoir plus

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