Thermal Fatigue of a Surface Mount Resistor
Application ID: 16083
A surface mount resistor is subjected to thermal cycling. The difference in the thermal expansion of different materials will introduce stresses in the structure. The solder which connects the resistor with the printed circuit board is seen as the weakest link in the assembly. It responds nonlinearly to changes in both temperature and time. In order to ensure the structural integrity of the component two fatigue analyses are performed. The first one predicts life based on the inelastic strain following a Coffin-Manson type model and the second uses the dissipated creep energy in the fatigue formulation.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® and
- Fatigue Module and
- Nonlinear Structural Materials Module and
- Structural Mechanics Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Grille de Spécifications and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.