Model Gallery
Copper Deposition in a Trench
This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track of the deformation of the mesh. Furthermore, electrochemical reaction kinetics through use of the ...
Electrochemical Impedance Spectroscopy
Electrochemical impedance spectroscopy (EIS) is a common technique in which a small oscillating perturbation in cell potential is applied to an electrochemical system so as to interrogate the kinetic and transport properties. The Electroanalysis interface is used with a frequency domain study to simulate EIS for a range of electrode reaction rates. Nyquist and Bode plots illustrate the transition ...
Cyclic Voltammetry at an Electrode
Cyclic voltammetry is a common analytical electrochemical technique, where the potential at a working electrode is swept over a range and back again while the current is recorded. The current-voltage waveform, referred to as a voltammogram, provides information about the reactivity and mass transport properties of an electrolyte. For large electrodes, the model is simplified to a 1D geometry by ...
Voltammetry at a Microdisk Electrode
Voltammetry is modeled at a microelectrode of 10um radius. In this common analytical electrochemistry technique, the potential at a working electrode is swept up and down and the current is recorded. The current-voltage waveform ("voltammogram") gives information about the reactivity and mass transport properties of the analyte. Microelectrodes are popular in electroanalysis because they ...
Decorative Plating
Tutorial model of electroplating. The model uses secondary current distribution with full Butler-Volmer kinetics for both anode and cathode. The thickness of the deposited layer at the cathode is computed as well as the pattern caused by dissolution of the anode surface.
Superfilling Electrodeposition
This example illustrates the concept of superfilling in electrodeposition. The deposition rate is accelerated in concave areas of the surface, where the concentration of a surface catalyst is increased due to the area contraction of the moving boundary.
Rotating Cylinder Hull Cell
Rotating Cylinder hull cells are an important experimental tool in electroplating and electrodeposition and are used for the measurement of non-uniform current distribution, mass transport and throwing power of plating baths. The model reproduces the results for a commercially available cell (RotaHull(R)) as published in paper [1]. In particular, it investigates the primary, secondary and ...
Secondary Current Distribution in a Zinc Electrowinning Cell
This is a model of the secondary current distribution in a zinc electrowinning cell. The model investigates the impact on the current distribution when changing the electrode alignment in a parametric study. The geometry is in 2D.
Multiphysics Simulation of the Electrochemical Finishing of Micro Bores
For several high-precision applications, especially in hydraulic systems and fuel injectors, micro bores are needed. In most cases the shape of the injection hole, especially the edge rounding, has a significant influence on the atomization of fluids and therefore on the combustion process. Usually these micro bores are machined by electrical discharge machining (EDM). Due to the process ...
Electrodeposition of a Microconnector Bump
This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal displays (LCDs) and driver chips. The location of the bumps on the electrode surface is controlled by the use ...
