La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
At the electrode-electrolyte interface, there is a thin layer of space charge in a diffuse double layer. This may be of interest when modeling devices such as electrochemical capacitors and nanoelectrodes. This tutorial example shows how to couple the Nernst-Planck equations to the ... En savoir plus
This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track ... En savoir plus
This tutorial example models the currents and the concentration of dissolved metal ions in a battery (corrosion cell) made from an orange and two metal nails. This type of battery is commonly used in chemistry lessons. Instead of an orange, lemons or potatoes can also be used. En savoir plus
Copper electrowinning is the process of copper extraction from an electrolyte solution and its deposition at the cathode surface, by passing an external current through the electrolytic cell and using an insoluble anode. During the process, oxygen bubbles are generated at the anode ... En savoir plus
When several components are to be electroplated they are typically mounted on a rack in the electroplating bath. An important aspect is then achieving a uniform thickness of the plated layer for all components mounted on the rack. This example model allows for investigating the effect ... En savoir plus
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... En savoir plus
Voltammetry is modeled at a microelectrode of 10um radius. In this common analytical electrochemistry technique, the potential at a working electrode is swept up and down and the current is recorded. The current-voltage waveform ("voltammogram") gives information about the reactivity and ... En savoir plus
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... En savoir plus
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... En savoir plus
This example models electrocoating of paint onto a car door in a time-dependent simulation. The deposited paint is highly resistive which results in lowered local deposition rates for coated areas. A primary current distribution in combination with a film resistance model is used to ... En savoir plus