Application ID: 10320
Tutorial model of electroplating. The model uses secondary current distribution with full Butler-Volmer kinetics for both anode and cathode. The thickness of the deposited layer at the cathode is computed as well as the pattern caused by dissolution of the anode surface.
This model is included as an example in the following products:Electrodeposition Module
however additional products may be needed to reproduce it. This example may be created and run using components from the following product combinations:
- COMSOL Multiphysics® and
- either the Batteries & Fuel Cells Module, Corrosion Module, Electrochemistry Module, or Electrodeposition Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Grille de spécifications and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.