La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Drying of porous media is an important process in the food and paper industry among others. Many physical effects must be considered: fluid flow, heat transfer with phase change, and transport of participating liquids and gases. All of these effects are strongly coupled, and predefined ... En savoir plus
This tutorial shows how to couple three physics interfaces to model evaporative cooling. The effects that need to be taken into account are heat transfer, transport of water vapor, and fluid flow. The Wet Surface feature is used to implement the source term for the water vapor and to ... En savoir plus
Thermoelectric elements are often used to cool or heat electronic components to a desired temperature. In such simulations, you are typically not interested in the behavior of the thermoelectric element itself but want to use its performance characteristics to model the overall response ... En savoir plus
Double-pipe heat exchangers, with their typical U-turn shape, are one of the simplest and cheapest type of heat exchangers used in the chemical process industry. This example studies the cooling of hot oil (130°C) by a cool oil (60°C) entering in counter-current. As the oils flow ... En savoir plus
This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using ... En savoir plus
This example demonstrates how to model phase transition by a moving boundary interface according to the Stefan problem. A square cavity containing both solid and liquid tin is submitted to a temperature difference between left and right boundaries. Fluid and solid parts are solved in ... En savoir plus
This example models the casting process of a metal rod from liquid to solid state using the Non-Isothermal Flow multiphysics interface, which combines heat transfer and fluid flow. The model describes the fluid and solid flow and heat transport, including the phase transfer from melt to ... En savoir plus
This model demonstrates the use of the Heat and Moisture Flow features for the simulation of superheated steam drying of a wood particle. A nonequilibrium formulation is used to compute the transport of the liquid water and vapor phases in the wood particle. Reference: Le, K. H., ... En savoir plus
This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach the Thin Layer boundary condition with the thermally thick option is used to avoid ... En savoir plus
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... En savoir plus
