La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Thermoelectric elements are often used to cool or heat electronic components to a desired temperature. In such simulations, you are typically not interested in the behavior of the thermoelectric element itself but want to use its performance characteristics to model the overall response ... En savoir plus
Thermal management of a battery pack is simulated considering two scenarios, air (natural convection) and phase change material (PCM) in the gap between the batteries. The PCM considered is a composite material of paraffin wax and graphite additive. Graphite is typically added for ... En savoir plus
This example demonstrates how to model a phase change and predict its impact on a heat transfer analysis. When a material changes phase, for instance from solid to liquid, energy is added to the solid. Instead of creating a temperature rise, the energy alters the material’s molecular ... En savoir plus
This example demonstrates how to model phase transition by a moving boundary interface according to the Stefan problem. A square cavity containing both solid and liquid tin is submitted to a temperature difference between left and right boundaries. Fluid and solid parts are solved in ... En savoir plus
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... En savoir plus
High-power battery energy storage systems (BESS) are often equipped with liquid-cooling systems to remove the heat generated by the batteries during operation. This tutorial demonstrates how to define and solve a high-fidelity model of a liquid-cooled BESS pack which consists of 8 ... En savoir plus
This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach the Thin Layer boundary condition with the thermally thick option is used to avoid ... En savoir plus
The Highly Accelerated Stress Test (HAST) is a testing technique to precipitate failure of electronic devices under elevated temperature and high humidity environment. This model demonstrates the structural analysis of a plastic encapsulated IGBT module under the HAST testing condition. ... En savoir plus
Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, ... En savoir plus
One method for removing cancerous tumors from healthy tissue is to heat the malignant tissue to a critical temperature that kills the cancer cells. This example accomplishes the localized heating by inserting a four-armed electric probe through which an electric current runs. Equations ... En savoir plus
