La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Freeze-drying, or lyophilization, is a process for drying heat-sensitive substances such as foods, blood plasma, and antibiotics. The wet substance is frozen and then, through sublimation, ice (or some other frozen solvent) is removed in the presence of a high vacuum. This example ... En savoir plus
Thermal management of a battery pack is simulated considering two scenarios, air (natural convection) and phase change material (PCM) in the gap between the batteries. The PCM considered is a composite material of paraffin wax and graphite additive. Graphite is typically added for ... En savoir plus
This example demonstrates how to model phase transition by a moving boundary interface according to the Stefan problem. A square cavity containing both solid and liquid tin is submitted to a temperature difference between left and right boundaries. Fluid and solid parts are solved in ... En savoir plus
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... En savoir plus
Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, ... En savoir plus
Thermoelectric elements are often used to cool or heat electronic components to a desired temperature. In such simulations, you are typically not interested in the behavior of the thermoelectric element itself but want to use its performance characteristics to model the overall response ... En savoir plus
The Highly Accelerated Stress Test (HAST) is a testing technique to precipitate failure of electronic devices under elevated temperature and high humidity environment. This model demonstrates the structural analysis of a plastic encapsulated IGBT module under the HAST testing condition. ... En savoir plus
This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach the Thin Layer boundary condition with the thermally thick option is used to avoid ... En savoir plus
Droplet evaporation is ubiquitous in everyday life, and is essential in many industrial processes such as ink-jet printing, cleaning or coating of surfaces, and phase change heat transfer. In this model, a water droplet placed on a solid substrate evaporates in air. We solve the ... En savoir plus
This example shows how to compute thermally induced stresses in a turbine stator blade using the Thermal Stress, Solid interface. The conditions within gas turbines are extreme. The pressure can be as high as 40 bar, and the temperature more than 1000 K. Any new component must therefore ... En savoir plus