La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Fatigue testing of nonlinear materials with creep mechanism is a time-consuming process. In accelerated life testing the experiment time is greatly reduced by subjecting the material to testing conditions in excess of the operating one. In the model an aggressive thermal load cycle is ... En savoir plus
In a cooling system, a microelectronic component has been identified as the critical link. Since the power is repeatedly switched on and off, the component is subjected to thermal cycling. As a results a crack grows through a solder joint and disconnects the chip from the printed circuit ... En savoir plus
Solar concentrator/cavity receiver systems can be used to focus incident solar radiation into a small region, generating intense heat which can then be converted to electrical or chemical energy. A common figure of merit in solar thermal power systems is the concentration ratio, or the ... En savoir plus
Uncertainty quantification is used to study the effect of manufacturing variation on the performance of a 2D solidly mounted resonator (2D SMR). This tutorial shows how the resonant frequency is affected by thickness variations of the piezoelectric layer and the Bragg reflector layers. ... En savoir plus
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... En savoir plus
In the semiconductor industry, rapid thermal annealing (RTA) is a semiconductor process step used for the activation of dopants and the interfacial reaction of metal contacts. In principle, the operation involves rapid heating of a wafer from ambient to approximately 1000–1500 K. As soon ... En savoir plus
This model shows how to model a simple Metal–Insulator–Metal (MIM) diode. The two metal electrodes are defined on each side using the Metal Contact feature. Two studies were performed: one without quantum tunneling across the potential barrier and the other including it, using the WKB ... En savoir plus
This industrial-scale proof of concept (POC) model demonstrates how to perform an electric-thermal analysis of a high-power insulated-gate bipolar transistor module (IGBT module). The module has a rated voltage of 1200 V, and nominal current of 1800 A. Using a stationary study the ... En savoir plus
A magnetic brake consists of a permanent magnet, which induces currents in a rotating copper disk. The resulting eddy currents interact with the magnetic flux to produce Lorentz forces and subsequently a braking torque. The disk angular velocity is computed using Simulink®. En savoir plus
The modal dispersion in a metamaterial can be engineered by changing the type of material and dimension of the composing unit cells. For instance, a periodically organized subwavelength metal–dielectric layered metamaterial exhibits an anisotropic dispersion characteristic in the ... En savoir plus