La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... En savoir plus
A Luneburg lens is a type of graded index, or GRIN lens, in which the gradient of the refractive index leads to special focusing properties. This example model uses the Geometrical Optics interface to compute the curved ray trajectories in the graded-index medium. En savoir plus
Laser systems are an important application area in modern electronics. With nonlinear materials it is possible to generate harmonics that are a multiple of the frequency of the laser light. This model shows how a second harmonic generation can be set up as a transient wave simulation, ... En savoir plus
This conceptual example shows how to calculate critical points in models with contact. The model consists of a block modeled with the Solid Mechanics interface pressing on an arch modeled with the Shell interface. The contact problem is solved using the augmented Lagrangian method. The ... En savoir plus
In this example, triaxial and oedometer tests are simulated using the Hardening Soil material model. Both tests exhibit a hyperbolic stress–strain relationship. For the triaxial test, it is confirmed that the axial stress approaches the analytical failure stress asymptotically. In the ... En savoir plus
As integrated circuit (IC) technology advances, with circuits becoming more powerful and compact, it is increasingly important to identify and prevent any cause of circuit failure. One particularly critical factor contributing to circuit failure is electromigration within the ... En savoir plus
Battery electrodes featuring large heterogeneities in terms of particle sizes may sometimes not be adequately described by homogenized models using one single particle size only. As an alternative to adding multiple instances of the Additional Porous Electrode material node, this ... En savoir plus
The model is defined as a benchmark case in norm 15026:2007 annex A. The purpose of the model is to calculate the temperature and moisture profiles at different times after a change in the external conditions (temperature and relative humidity) inside a wall material (kind of concrete). ... En savoir plus
This example model consists of a two-hot-arm thermal actuator made of polysilicon. The actuator is activated through thermal expansion. The temperature increase required to deform the arms, and thus displace the actuator, is obtained through Joule heating (resistive heating). The greater ... En savoir plus
The dielectric shielding boundary condition is meant to approximate a thin layer of material with high relative permittivity compared to its surroundings. This boundary condition is available for electrostatic field modeling. This example compares the dielectric shielding boundary ... En savoir plus