La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This example illustrates a linear buckling analysis conducted for a corrugated conical shell, utilizing a single sector of the geometry along with cyclic symmetry periodicity edge conditions. The results are compared to those using the full shell geometry. En savoir plus
The homogenized material properties of a composite are computed based on the temperature-dependent properties of matrix and fiber. The homogenized parameters are compared to the analytical values derived from the rule of mixtures. This is an extension of model https://www.comsol.com ... En savoir plus
This model showcases a nail penetration experiment into a layered battery. It couples the Solid Mechanics, Lithium-Ion Battery, and Heat Transfer interfaces. A nail is punched into a sandwiched battery consisting of two electrodes and a separator. As soon as the nail connects both ... En savoir plus
This is a demo model to show how to model connections in a mechanical system using Multibody Dynamics interface. In this model, pantograph mechanism is modeled. The purpose of this mechanism is to produce an identical, either enlarged or miniaturized, copy of an existing drawing. En savoir plus
In this model, the stress concentrations around a superelliptic hole in a thin plate are investigated. To learn more about this model, see our accompanying blog post “Stress Concentrations Around a Superellipse”. En savoir plus
This model demonstrates how to extract the lumped parameters for an mBVD equivalent circuit from a FEM simulation and how to leverage such a model directly using the Electrical Circuit interface. A 3D layered FBAR resonator is considered as an example. Related Blog Post Leveraging the ... En savoir plus
In direct bonding, the in-plane relative displacement between corresponding points on the bonding surfaces of the top and bottom wafers, denoted as IPD (In-Plane Distortion), is the primary yield killer in the bonding process. This model can predict the entire direct wafer bonding ... En savoir plus
Flip chip (FC) is a widely-used form of advanced semiconductor packaging, which yields small size, high interconnection density, and good signal transmission performance of the semiconductor device. In FC devices, the chip is placed face down and directly bonded to the substrate, or ... En savoir plus
