La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
Interfacial failure by delamination or debonding can be simulated with a Cohesive Zone Model (CZM). This example shows the implementation of a CZM with a bilinear traction-separation law. It is used to predict the mixed-mode softening onset and delamination propagation in a composite ... En savoir plus
This is a conceptual model illustrating how to couple fluid-structure interaction, heat transfer, and thermal expansion. A bimetallic strip in an air channel is heated so that it bends. After some time, an airflow with an inlet temperature which varies in time is introduced. As a ... En savoir plus
This model shows how to use the scattered field formulation to compute the transmission coefficient for impinging P and S plane elastic waves onto a finite size phononic crystal. The transmission tends to zero in the frequency range corresponding to P- and S-wave band gaps, as ... En savoir plus
This is a tutorial example, showing how to work with pretensioned bolts. Various aspects of bolt modeling are explored: Modeling bolts as solids or by beams Connections of beams to solid components Bolts ended by nuts or by internal threads in the attached component Import of bolt and ... En savoir plus
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... En savoir plus
The Highly Accelerated Stress Test (HAST) is a testing technique to precipitate failure of electronic devices under elevated temperature and high humidity environment. This model demonstrates the structural analysis of a plastic encapsulated IGBT module under the HAST testing condition. ... En savoir plus
This example explores the shift in natural frequencies caused by changing the temperature. One study investigates a doubly clamped beam where both ends are fixed, while the other study looks at a cantilever beam where only one end is fixed. The following effects are studied: Stress ... En savoir plus
In his example, the lowest natural frequency of a 3D bracket are maximized using shape optimization. En savoir plus
Solid-state batteries (SSB) are a promising technology that could suffer from internal mechanical stresses due to the growth and shrinkage of the electrodes within all-solid components. With this model, the charge-discharge cycling of an SSB is simulated with a focus on the interaction ... En savoir plus
In this example of a peristaltic pump, rollers squeeze a flexible tube and the compression drives a fluid through the tube. The model demonstrates how to use the Fluid-Structure Interaction interface. The main advantage of the peristaltic pump is that no seals, valves or other internal ... En savoir plus
