La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
A surface mount resistor is subjected to thermal cycling. The difference in the thermal expansion of different materials will introduce stresses in the structure. The solder which connects the resistor with the printed circuit board is seen as the weakest link in the assembly. It ... En savoir plus
Fatigue testing of nonlinear materials with creep mechanism is a time-consuming process. In accelerated life testing the experiment time is greatly reduced by subjecting the material to testing conditions in excess of the operating one. In the model an aggressive thermal load cycle is ... En savoir plus
This example investigates the electrical performance of a cascaded cavity filter operating in the millimeter-wave 5G band with temperature changes. The thermal variations result in structural deformations of the structure. Thus, the resonant frequencies of the filter elements (cavities) ... En savoir plus
In this example, a random vibration test of electronic equipment is simulated. Three analyses are performed, one for acceleration in each global direction. Accelerations in the components and forces in clamping bolts are evaluated. En savoir plus
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... En savoir plus
Electronic equipment often has to be certified to function after having been subjected to a specified shock load. In this example, the effect of an 50g 11ms half sine shock on a circuit board is investigated using response spectrum analysis. The results are compared with a time domain ... En savoir plus