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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

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Heat Transfer and Phase Change

A Computational Study on Thermal Conductivity Measurements of High Temperature Liquid Materials

X. Ye[1], R. W. Hyers[1]
[1]Department of Mechanical & Industrial Engineering, University of Massachusetts - Amherst, Amherst, MA, USA

Accurate thermo-physical properties of materials are valuable for both scientific research and industrial applications. For high temperature liquid materials, two issues exclude traditional methods: elevated reactivity of test material and experimental apparatus, uncontrolled heat ... En savoir plus

Passive Thermal Control for Window Insulation

E. Konroyd-Bolden[1], Dr. Z. Liao[1]
[1]Department of Architectural Science, Ryerson University, Toronto, ON, Canada

A requirement of the building envelope is to act as environmental separator. Energy is one component that we sometimes wish to control. How can this yield passive benefits such as solar heating? This research focuses on control of thermal radiation energy, and the role windows play ... En savoir plus

Modeling Flow and Deformation During Salt-Assisted Puffing of Single Rice Kernels

T. Gulati[1], A. K. Datta[1]
[1]Department of Biological & Environmental Engineering, Cornell University, Ithaca, NY, USA

Puffing of biomaterials involves mass, momentum and energy transport along with large volumetric expansion of the material. Development of physics-based models that can describe heat and moisture transport, rapid evaporation and large deformations can help understand the puffing process. ... En savoir plus

Calibration of a Geothermal Energy Pile Model

R. Caulk[1], J. McCartney[2], E. Ghazanfari[1]
[1]University of Vermont, Burlington, VT, USA
[2]University of Colorado, Boulder, CO, USA

In this study, a model of in-situ geothermal energy piles was constructed using COMSOL Multiphysics® software. Geothermal energy piles serve two purposes, first to transfer building load into the subsurface, but also to extract thermal heat from surrounding soils. This is achieved using ... En savoir plus

Convective Cooling of Electronic Components

J. S. Crompton[1], H. Singh[1], K. Koppenhoefer[1]
[1]AltaSim Technologies, LLC, Columbus, OH, USA

In response to continued miniaturization and increased multi-functionality of electronic circuits, the number of integrated circuit (IC) packages on the circuit board continues to increase. As a consequence the operating power density increases and significant increases in the operating ... En savoir plus

Thermal Analysis of Additive Manufacturing

S. Yushanov[1], J. S. Crompton[1], K. C. Koppenhoefer[1]
[1]AltaSim Technologies, LLC., Columbus, OH, USA

This study analyzed the laser powder bed additive manufacturing process. The laser is modeled as a moving heat source with time dependent heat transfer causing local, transient melting of the metal powder. Heat transfer is considered to take place due to convection in the molten metal ... En savoir plus

AC Electrothermal Characterization of Doped-Si Heated Microcantilevers Using Frequency-Domain Finite Element Analysis

K. Park[1], S. Hamian[1], A. M. Gauffreau[2], T. Walsh[2]
[1]Mechanical Engineering Department, University of Utah, Salt Lake City, UT, USA
[2]Department of Mechanical, Industrial & Systems Engineering, University of Rhode Island, Kingston, RI, USA

This work investigates the frequency-dependent electrothermal behaviors of freestanding doped-silicon heated microcantilever probes operating under the periodic (ac) Joule heating. The transient heat conduction equation for each component (i.e., the low-doped heater region, the high ... En savoir plus

Numerical Simulation of Thermal Runaway in a THz GaAs Photoconductor

S. Sarodia[1,2], W. Zhang[2], E. Brown[2]
[1]Centerville High School, Dayton, OH, USA
[2]Wright State University, Dayton, OH, USA

Ultrafast terahertz photoconductor devices, especially photomixers, are usually limited in output power by device failure thought to be caused by excessive temperatures. Therefore, understanding of thermal breakdown is essential to the study of device reliability and failure of ... En savoir plus

Direct Modeling of Packed Bed Channeling

R. Schunk[1], J. Knox[1], R. F. Coker[1]
[1]NASA Marshall Space Flight Center, Huntsville, AL, USA

An analysis to quantify the effects of packed bed channeling in the narrow passages of the ISS (International Space Station) CDRA (Carbon Dioxide Removal Assembly) is presented. The CDRA contains two pelletized adsorbent beds to remove CO2 respired by the crew. Each CO2 adsorbent bed is ... En savoir plus

Baffle Design: Tube-in-Shell Electrical Gas Heaters

K. Lund[1], S. Lord[2]
[1]Kurt Lund Consulting, San Diego, CA, USA
[2]SML Associates, Encinitas, CA, USA

It is frequently necessary to electrically heat gases; a convenient geometry is the familiar tube-in-shell heat exchanger, where the tube side is modified for electrical heater-rods, and the baffled shell side contains the flowing gas, as indicated in Fig. 1. However, this modification ... En savoir plus

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