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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

Consultez les proceedings de la Conference COMSOL 2024

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MEMS and Nanotechnology

Microfluidic Separation System for Magnetic Beads

F. Wittbrach, A. Weddemann, A. Auge, and A. Hütten
Department of Physics, Bielefeld University, Germany

It is possible to control the motion of magnetic beads using a combination of hydrodynamic and electromagnetic forces. In this work, we investigate the possibility to manipulate the motion of beads with different magnetic moments in a special microfluidic structure so as to separate ... En savoir plus

Interfacing Continuum and Discrete Methods: Convective Diffusion of Microparticles and Chemical Species in Microsystems

J. Berthier
CEA-LETI, Department of Biotechnology, Grenoble, France

Convective transport of macromolecules or micro and nanoparticles in microsystems are usually predicted by solving the Navier Stokes equations for the carrier fluid and a concentration equation for the diffusing species. In the case of isolated particles or complicated geometries with ... En savoir plus

Simple Finite Element Model of the Topografiner

H. Cabrera[1], D. A. Zanin[1], L. G. De Pietro[1], A. Vindigni[1], U. Ramsperger[1], D. Pescia[1]
[1]Laboratory for Solid State Physics, ETH Zürich, Zürich, Switzerland

In our recent experiments we are revisiting the topografiner technology for the imaging of surface topography with a resolution of a few nanometers. In these new technique called Near-Field Emission Scanning Electron Microscopy (NFESEM), low-energy electrons are emitted from a ... En savoir plus

Heterodimensional Charge-Carrier Confinement in Sub-Monolayer InAs in GaAs

S. Harrison[1], M. Young[1], M. Hayne[1], P. D. Hodgson[1], R. J. Young[1], A. Strittmatter[2], A. Lenz[2], U. W. Pohl[2], D. Bimberg[2]
[1]Department of Physics, Lancaster University, Lancaster, UK
[2]Institut für Festkörperphysik, Berlin, Germany

Low-dimensional semiconductor nanostructures, in which charge carriers are confined in a number of spatial dimensions, are the focus of much solid-state physics research, offering superior optical and electronic properties over their bulk counterparts. Both two-dimensional (2D) and zero ... En savoir plus

Finite Element Analysis of Temperature and Viscosity Effects on Resonances in Thin-Film Bulk Acoustic Wave Resonators

G. Rughoobur[1], M. DeMiguel-Ramos[2], L. García-Gancedo[1], M. Clement[2], J. Olivares[2], T. Mirea[2], W. I. Milne[1], E. Iborra[2], A. J. Flewitt[1]
[1]University of Cambridge, Cambridge, UK
[2]Universidad Politécnica de Madrid, Madrid, Spain

The shear mode of film bulk acoustic resonators (FBARs) is preferred to the longitudinal mode owing to its lower acoustic losses in a liquid. However in addition to mass loading, the resonance is also affected by temperature and liquid viscosity. These two parameters can either be sensed ... En savoir plus

Plasmonics of Nano-Gaps

T. Hutter[1], S. Mahajan[2], S. R. Elliott[1]
[1]University of Cambridge, Cambridge, UK
[2]University of Southampton, Southampton, UK

Plasmons, i.e. the collective oscillations of electrons in a metallic nano-structure, lead to strong light scattering, absorption and an enhancement of the local electromagnetic field. In this work, the local electric-field enhancement in a system of dielectric nanoparticles placed ... En savoir plus

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have ... En savoir plus

Air Damping Simulation of MEMS Torsional Paddle

N. Mahmoodi[1], C. J. Anthony[1]
[1]University of Birmingham, Birmingham, UK

Viscous damping has a significant effect on dynamic performance of the resonators operating within fluid. This work is aimed to find the viscous damping for MEMS torsional paddle operating in air. Interaction of moving structure with the fluid requires a complicated and challenging ... En savoir plus

MEMS Acoustic Pixel

A. Arevalo[1], I. G. Foulds[2]
[1]King Abdullah University of Science and Technology, Thuwal, Saudi Arabia
[2]The University of British Columbia, Vancouver, BC, Canada

A COMSOL Multiphysics® simulation was used to simulate the behavior of a micro-membrane (Acoustic Pixel) to be used as a potential acoustic transducer. The MEMS and Piezoelectric devices interfaces were used to simulate such transducer. A four-cantilever spring configuration is initially ... En savoir plus

2D Simulation of Cardiac Tissue

S. Esfahani[1]
[1]University of South Florida, Tampa, FL, USA

A two-dimensional atrial tissue model has been constructed in COMSOL Multiphysics® software to study the propagation of action potential and electrograms. The model presents the atrial electrograms recorded with a mapping catheter. A 2D atrial tissue model is simulated using the ... En savoir plus

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