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Ici vous trouverez les présentations issues des Conférences COMSOL à travers le monde. Réalisées par des utilisateurs de COMSOL Multiphysics, ces présentations explorent tous les domaines actuels d'innovation. Les applications couvrent pratiquement tous les secteurs industriels et impliquent des phénomènes électriques, mécaniques, fluidiques et chimiques. Utilisez la recherche rapide pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt.

Consultez les proceedings de la Conference COMSOL 2024

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Boston 2024

Munich 2023

Terme recherché:

fluid-structure interaction

Modeling the Dynamic Viscous and Thermal Dissipation Mechanisms in a Fibrous Porous Material

B.P. Semeniuk [1], P. Göransson [1],
[1] KTH Royal Institute of Technology, Marcus Wallenberg Laboratory for Sound and Vibration Research, Stockholm, Sweden

The main mechanisms of acoustic attenuation in a bundle of fibres typical of lightweight fibrous porous materials are the dynamic viscous drag forces on the surface of the fibres, and the thermal heat transfer between the solid fibres and the surrounding fluid. Microstructure models ... En savoir plus

Plasma Edge Simulations by Finite Elements using COMSOL

C. Hollenstein, and A. Howling
Ecole Polytechnique Fédérale de Lausanne, Switzerland

Finite elements using COMSOL Multiphysics have been used to simulate the edge plasma in a large area capacitively coupled RF reactor. In order to reduce numerical difficulties simplified reactor edge geometries have been used. First results show the importance of electrostatic double ... En savoir plus

Finite Element Modeling of a Cell Lysing Chip

S. Maloney[1,2], Y. Li[1,2], G. Auner[1], and J. Smolinski[1]
[1]Wayne State University, Detroit, MI, USA
[2]Lawrence Technological University, Southfield, MI, USA

We are working on a microfabricated lysing chip that uses a piezoelectric actuator to provide ultrasonic energy to break apart cells. The device contains pillars with varying dimensions. We hypothesize that increasing the aspect ratio of pillars will increase the efficiency of the ... En savoir plus

Modeling and Simulation of Damping Resistance of a Cantilever Based Energy Harvester

M. I. Hassan [1], A. Brimmo [1], A. N. Chatterjee [2],
[1] Masdar Institute of Science and Technology, Abu Dhabi, UAE
[2] MEMS Department, GLOBALFOUNDRIES, Singapore, Singapore

The multilayer composite single mass cantilever is a MEMS energy harvester structure. The vibrating structure is under vacuum in hermetic MEMS. However, out-gassing during process integration and fabrication would cause air molecules (e.g. hydrogen, nitrogen, argon, water vapor, oxygen, ... En savoir plus

Simulation of Acoustically Excited Membrane Waves on an Eye

J. Mäkinen [1], D. Veira Canle [1], T. Ylitalo [1], R. Montonen [1], H. Malinen [1], S. Bäckroos [1], P. Ihalainen [1], E. Lampsijärvi [1], J. Heikkilä [1], T. Paulin [1], A. Salmi [1], A. Kontiola [1], I. Kassamakov [1], E. Hæggström [1],
[1] Department of Physics, Division of Materials Physics, University of Helsinki, Helsinki, Finland

High intraocular pressure (IOP) is a risk factor for glaucoma, a condition that can cause blindness. Conventional ways of measuring IOP either require contact or can be uncomfortable for the patient. We have developed a method to measure IOP from the propagation time of a wave on the ... En savoir plus

Simulating Microbubble Flows Using COMSOL Multiphysics

X. Chen[1], and S. Ghadiali[1,2]

[1]Mechanical Engineering and Mechanics, Lehigh University, Bethlehem, PA, USA
[2]Bio Engineering program, Lehigh University, Bethlehem, PA, USA

Acute respiratory distress syndrome (ARDS) is a severe lung disease caused by a variety of direct and indirect insults. The main treatment for ARDS is mechanical ventilation. The ventilation of fluid filled lungs involves the propagation of microbubbles over a layer of epithelial cells. ... En savoir plus

Thin Microchip Release From a Carrier Tape: Structural Mechanics and Vacuum Forces

S. Behler[1]
[1]Besi Switzerland AG, Switzerland

During semiconductor manufacturing, finished silicon microchips need to be released from a carrier tape they stick to by an adhesive. This is done by vacuum forces that (a) hold the chip flat from above and (b) pull the tape off from the chip underside. Sounds simple, but is very tricky ... En savoir plus

A COMSOL Multiphysics® Software Analysis of Beam Tube Cooling in the High Flux Isotope Reactor of ORNL

J. D. Freels [1],
[1] Research Reactors Division, Oak Ridge National Laboratory, Oak Ridge, TN, USA

Previous to the present work, a formal calculation was approved [1,2] to support the operation of the High Flux Isotope Reactor (HFIR) Horizontal Beam-Tube 1 of 4 (HB-1). The present calculation [3,4] repeats the previous work using COMSOL Multiphysics® software and extends the analysis ... En savoir plus

Modeling of Directional Dependence in Nanowire Flow Sensor

A. Piyadasa[1,3], P. Gao[1,2,3]
[1]Department of Physics, University of Connecticut, Storrs, CT, USA
[2]Department of Materials Science & Engineering, University of Connecticut, Storrs, CT, USA
[3]Institute of Materials Sciences, University of Connecticut, Storrs, CT, USA

3D finite element analysis model has been constructed for testing the directional dependence in a novel form of nanowire array gas flow sensor. Single nanowire (p-type single crystal Silicon) model is developed using fluid structure interaction and piezoresistivity components in the MEMS ... En savoir plus

Simulation of the Self Assembly of a Microchip on a Structured Surface using the Phase Field Method

N. Boufercha, M. Ghahremanpour, M. Schnaithmann, J. Sägebarth, and H. Sandmaier
Universität Stuttgart / IFF-MST, Nobelstr.12, Stuttgart, Germany

The presented paper describes a method for micro precision assembly of very small objects like future microchips, which have a lateral expansion equal to or smaller than 500 μm. The modelling and simulation of a fluidicbased micro assembly method for a microchip with a dimension of ... En savoir plus

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