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Découvrez comment la simulation multiphysique contribue à faire progresser la recherche dans le monde entier grâce à des applications innovantes

La modélisation et la simulation multiphysiques stimulent l'innovation dans l'industrie et le monde universitaire, comme en témoignent les nombreuses applications présentées chaque année par des ingénieurs, des chercheurs et des scientifiques dans leurs articles techniques et posters lors des conférences COMSOL.

Inspirez-vous des travaux présentés lors des dernières conférences, rassemblés ci-dessous. Pour trouver une présentation en particulier ou affiner votre recherche par domaine d'application, année ou lieu de conférence, utilisez l'outil de recherche rapide.

Consultez les proceedings de la Conference COMSOL 2026

Stress Field Simulation for Quantitative Ultrasound Elasticity Imaging

L. Yuan[1] and P.C. Pedersen[1]
[1]Department of Electrical and Computer Engineering, Worcester Polytechnic Institute, Worcester, Massachusetts, USA

Finite element models using COMSOL Multiphysics and MATLAB were developed to solve the problem of stress distribution interior homogeneous, isotropic, incompressible elastic solid material under known vertical external compression with a rectangular contact surface. Moreover, comparison ... En savoir plus

Study of Fluid and Mass Adsorption Model in the QCM-D Sensor for Characterization of Biomolecular Interaction

H.J. Kwon[1], C.K. Bradfield[1], B.T. Dodge[1], and G.S. Agoki[1]
[1]Department of Engineering and Computer Science, Andrews University, Berrien Springs, Michigan, USA

Increasing attention has been paid to application of the quartz crystal microbalance with dissipation (QCM-D) sensor for monitoring biomolecular interactions. This paper focuses on a practical application of protein-protein binding affinity measurement at low concentrations and minimal ... En savoir plus

The Effect of a Correlated Surface Roughness and Convection on Heat Conduction

A.F. Emery[1]
[1]Department of Mechanical Engineering, University of Washington, Seattle, Washington, USA

Heat conduction through a slab, 0 ≤ x ≤ W is one dimensional. However, if one of the edges, say x=0, is rough the conduction will be two dimensional. The two dimensionality varies with the correlation length with a maximum at a length approximately 10% of the slab width. ... En savoir plus

Viscous damping of a periodic perforated MEMS microstructure when the Reynolds’ equation cannot be applied: Numerical simulations

D. Homentcovschi[1], and R.N. Miles[1]
[1]Department of Mechanical Engineering, SUNY Binghamton, NY

This paper develops a computational model for determining the total damping coefficient for a unit cell of a MEMS microscale device containing a repetitive pattern of holes. The basic cell of the microstructure is approximated by an axi-symmetric domain and the velocity and pressure ... En savoir plus

Finite Element Analysis of Thermal Fatigue in Thermal Barrier Coatings

U. Bardi[1], C. Borri[1], A. Fossati[1], A. Lavacchi[1], and I. Perissi[1]
[1]Dipartimento di Chimica, Università degli Studi di Firenze, Sesto Fiorentino, FI, Italy

A Finite element model of plasma sprayed TBC’s was developed to estimate the stress induced by thermal cycling experiments. A heat transfer analysis was performed to evaluate the temperature distribution on the specimen during the cooling under an impinging air jet; temperature ... En savoir plus

Importance of Assembly Discontinuity Factors In Simulating Reactor Cores Containing Highly Heterogeneous Fuel Assemblies

G. Gomes[1]
[1]Atomic Energy of Canada Limited, Mississuaga, Ontario, Canada

To assess the importance of assembly discontinuity factors (ADF), a highly heterogeneous reactor core was simulated using a COMSOL model in which ADF are not used. The resulting errors in assembly powers were found to be unacceptably high. This indicates that for highly heterogeneous ... En savoir plus

Thermal Design of Power Electronic Devices and Modules

N. Delmonte[1], M. Bernardoni[1], P. Cova[1], and R. Menozzi[1]
[1]Dipartimento di Ingegneria dell’Informazione, University of Parma, Parma, Italy

This work describes a way to apply 3D Finite Element Analysis (FEA) to the thermal design of power electronic modules using simplified geometry models of the system components. The method here presented can overcome the problem of solving equation systems with a very high number of ... En savoir plus

Simulation of the Convective Heat Transfer and Working Temperature Field of a Photovoltaic Module Using COMSOL Multiphysics^®

E. Ruiz-Reina[1] and M. Sidrach-de-Cardona[1]
[1]Departamento de Física Aplicada II, Universidad de Málaga, Málaga, Spain

The aim of this work is the Finite Element Analysis (FEA), by using COMSOL Multiphysics®, of the convective heat transfer and working temperature field of a photovoltaic module under different wind conditions. En savoir plus

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