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Ici vous trouverez les présentations issues des Conférences COMSOL à travers le monde. Réalisées par des utilisateurs de COMSOL Multiphysics, ces présentations explorent tous les domaines actuels d'innovation. Les applications couvrent pratiquement tous les secteurs industriels et impliquent des phénomènes électriques, mécaniques, fluidiques et chimiques. Utilisez la recherche rapide pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt.

Consultez les proceedings de la Conference COMSOL 2024

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Fluid Flow Simulation of Preconcentration Membranes Using Finite Elements Tools

R. Inglés[1], J. Pallares[2], J.L. Ramirez[1], and E. Llobet[1]

[1]Dept. of Electronic, Electrical and Automatic Control Engineering, Universitat Rovira i Virgili, Tarragona, Spain
[2]Department of Mechanical Engineering School of Chemical
Engineering Universitat Rovira i Virgili, Tarragona, Spain

We use finite elements simulations in order to study the fluid flow behavior in a chamber of a preconcentrator. We realized that most part of the fluid does not affect our preconcentrator because it is going out the chamber at high distance above it and parallel to the preconcentrator. ... En savoir plus

Modeling of Silicon Transport into Germanium Using a Simplified Crystal Growth Technique

F. Mechighel[1][3], B. Pateyron[1], M. El Ganaoui[1], S. Dost[2], and M. Kadja[3]

[1]Laboratory SPCTS UMR CNRS, ENSCI, Limoges University, Limoges, France
[2]Crystal Growth Laboratory, Department of Mechanical Engineering, University of Victoria, British Columbia, Victoria, Canada
[3]Department of Mechanical Engineering, University of Constantine, Constantine, Algeria

A numerical simulation study, using COMSOL Multiphysics®, was carried out to examine the temperature and concentration fields in the dissolution process of silicon into germanium melt. This work utilized a simplified configuration which may be considered to be similar material ... En savoir plus

Thermo-fluid Dynamics Modelling of Hydrogen Absorption and Desorption in a LaNi_4.8Al_0.2 Hydride Bed

D. Baldissin[1] and D. Lombardo[1]
[1]Compumat S.r.l., Torino, Italy

A two-dimensional mathematical model for the absorption and desorption of H2 in LaNi4.8Al0.2 was developed and experimentally validated. The model is composed of an energy balance, a mass balance and a momentum balance. These differential equations are numerically solved by means of the ... En savoir plus

Chemical Reactions in a Microfluidic T-Sensor: Numerical Comparison of 2D and 3D Models

R. Winz[1][2], N. Schröder[1], W. Wiechert[1], and E. von Lieres[1]
[1]Institute of Biotechnology 2, Research Centre Jülich, Jülich, Germany
[2]Research Center for Micro and Nanochemistry, University of Siegen, Siegen, Germany

In recent years lab-on-microchip technology has become a powerful tool for micro-scale analysis of biochemical processes. In the studied system the overall process consists of transport, convection, diffusion, reaction and adsorption processes. Two compounds A and B, contained in a ... En savoir plus

Local Conduction Heat Transfer in U-pipe Borehole Heat Exchangers

J. Acuna[1] and B. Palm[1]

[1]Department of Energy Technology, KTH, Stockholm, Sweden

The most common way to exchange heat with the bedrock in Ground Source Heat Pump (GSHP) applications is circulating a fluid through a U-formed closed loop in vertical boreholes drilled several tenths of meters into the ground. This study presents and compares the results of eight cross ... En savoir plus

Detection of Magnetic Particles by Magnetoresistive Sensors

A. Weddemann[1], A. Auge[1], F. Wittbracht[1], C. Albon[1], and A. Hütten[1]
[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

In this work, we demonstrate the implementation of the micromagnetic equations for the description of ferromagnetic thin films in COMSOL Multiphysics®. We apply our model to magnetoresistive sensors consisting of several soft ferromagnetic layers and their response to magnetic particles. ... En savoir plus

Model of Heat and Mass Transfer with Moving Boundary During Roasting of Meat in Convection-Oven

A.H. Feyissa[1], J. Adler-Nissen[1], and K.V. Gernaey[2]
[1]Food Production Engineering, National Food Institute, Technical University of Denmark, Kgs. Lyngby, Denmark
[2]Department of Chemical and Biochemical Engineering, Technical University of Denmark, Kgs. Lyngby, Denmark

A 2D mathematical model of coupled heat and mass transfer describing oven roasting of meat was formulated from first principles. The current formulation of model equations incorporates the effect of shrinkage phenomena and water holding capacity. The model equations are based on ... En savoir plus

3D Electro-Thermal Study for Reliability of Automotive Power Vertical MOSFET Using COMSOL Multiphysics^®

T. Azoui[1], S. Verde[1][2], J.B. Sauveplane[1], and P. Tounsi[1]
[1]LAAS-CNRS, Toulouse, France
[2]Department of Electronics and Telecommunications Engineering, University of Naples Federico II, Naples, Italy

In this paper 3D electro-thermal FE Model using COMSOL Multiphysics® software of power vertical MOSFET used in the automotive industry is presented. This model is used to analyze the effects of bonding wire lift off defect and to study the influence of metallization thickness and ... En savoir plus

Thermal Simulation and Package Investigation of Wireless Gas Sensors

A. Paoli[1], L. Seminara[2], D.D. Caviglia[1], A. Garibbo[2], and M. Valle[1]

[1]Department of Biophysical and Electronic Engineering, University of Genova, Genova, Italy
[2]SELEX Communications S.p.A., Genova, Italy

Gas sensor arrays based on metal oxides operating at high temperature are commonly used in many application fields. They can operate on different principles and each sensor may show very different responses to the individual gases in the environment. Data coming from the array can be ... En savoir plus

Chip Drop After Silver Sintering Process

M.H. Poech[1], M. Weiß[1], and K. Gruber[1]

[1]Fraunhofer Institute for Silicon Technology, Itzehoe, Germany

Since a couple of years, sintering becomes more and more important for power electronics. To press a semiconductor under high temperature in silver paste on a substrate promises benefits for durability. Tests with semiconductors of different thickness expose some problems. After the cool ... En savoir plus

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